Advanced Short-time Thermal Processing for Si-based CMOS Devices
Author: Fred Roozeboom
Publisher: The Electrochemical Society
Published: 2003
Total Pages: 488
ISBN-13: 9781566773966
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Handbook of Silicon Based MEMS Materials and Technologies
Author: Markku Tilli
Publisher: William Andrew
Published: 2015-09-02
Total Pages: 827
ISBN-13: 0323312233
DOWNLOAD EBOOKThe Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures - Geared towards practical applications rather than theory
Simulation of Semiconductor Processes and Devices 2001
Author: Dimitris Tsoukalas
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 463
ISBN-13: 3709162440
DOWNLOAD EBOOKThis volume contains the Proceedings of the International Conference on Simulation of Semiconductor Devices and Processes, SISPAD 01, held on September 5–7, 2001, in Athens. The conference provided an open forum for the presentation of the latest results and trends in process and device simulation. The trend towards shrinking device dimensions and increasing complexity in process technology demands the continuous development of advanced models describing basic physical phenomena involved. New simulation tools are developed to complete the hierarchy in the Technology Computer Aided Design simulation chain between microscopic and macroscopic approaches. The conference program featured 8 invited papers, 60 papers for oral presentation and 34 papers for poster presentation, selected from a total of 165 abstracts from 30 countries around the world. These papers disclose new and interesting concepts for simulating processes and devices.
Strained-Si Heterostructure Field Effect Devices
Author: C.K Maiti
Publisher: CRC Press
Published: 2007-01-11
Total Pages: 438
ISBN-13: 1420012347
DOWNLOAD EBOOKA combination of the materials science, manufacturing processes, and pioneering research and developments of SiGe and strained-Si have offered an unprecedented high level of performance enhancement at low manufacturing costs. Encompassing all of these areas, Strained-Si Heterostructure Field Effect Devices addresses the research needs associated wi
Simulation of Semiconductor Processes and Devices 2007
Author: Tibor Grasser
Publisher: Springer Science & Business Media
Published: 2007-09-18
Total Pages: 472
ISBN-13: 3211728600
DOWNLOAD EBOOKThe "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presentaƯ tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad specƯ trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites
The NeuroProcessor
Author: Yevgeny Perelman
Publisher: Springer Science & Business Media
Published: 2008-08-20
Total Pages: 126
ISBN-13: 1402087268
DOWNLOAD EBOOKUnderstanding brain structure and principles of operation is one of the major challengesofmodernscience.SincetheexperimentsbyGalvanionfrogmuscle contraction in 1792, it is known that electrical impulses lie at the core of the brain activity. The technology of neuro-electronic interfacing, besides its importance for neurophysiological research, has also clinical potential, so called neuropr- thetics. Sensory prostheses are intended to feed sensory data into patient’s brain by means of neurostimulation. Cochlear prostheses [1] are one example of sensory prostheses that are already used in patients. Retinal prostheses are currently under research [2]. Recent neurophysiological experiments [3, 4] show that brain signals recorded from motor cortex carry information regarding the movement of subject’s limbs (Fig. 1.1). These signals can be further used to control ext- nal machines [4] that will replace missing limbs, opening the ?eld of motor prosthetics, devices that will restore lost limbs or limb control. Fig. 1.1. Robotic arm controlled by monkey motor cortex signals. MotorLab, U- versity of Pittsburgh. Prof Andy Schwartz, U. Pitt 2 1 Introduction Another group of prostheses would provide treatment for brain diseases, such as prevention of epileptic seizure or the control of tremor associated with Parkinson disease [5]. Brain implants for treatment of Epilepsy and Parkinson symptoms (Fig. 1.2) are already available commercially [6, 7]. Fig. 1.2. Implantable device for Epilepsy seizures treatment [7]. Cyberonics, Inc.
High Purity Silicon VI
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
Published: 2000
Total Pages: 720
ISBN-13: 9781566772846
DOWNLOAD EBOOK"... papers that were presented at the Sixth Symposium on High Purity Silicon held in Phoenix, Arizona at the 198th Meeting of the Electrochemical Society, October 22-27, 2000."--Preface.
Semiconductor Wafer Bonding 9: Science, Technology, and Applications
Author: Helmut Baumgart
Publisher: The Electrochemical Society
Published: 2006
Total Pages: 398
ISBN-13: 156677506X
DOWNLOAD EBOOKThis issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
SiGe, Ge, and Related Compounds 3: Materials, Processing, and Devices
Author: David Harame
Publisher: The Electrochemical Society
Published: 2008
Total Pages: 1136
ISBN-13: 1566776562
DOWNLOAD EBOOKAdvanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds have become a key component of the arsenal in improving semiconductor performance. This issue of ECS Transactions discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
Code of Federal Regulations
Author:
Publisher:
Published: 2005
Total Pages: 784
ISBN-13:
DOWNLOAD EBOOKSpecial edition of the Federal Register, containing a codification of documents of general applicability and future effect ... with ancillaries.
