Semiconductor Technology (ISTC 2001)
Author: Ming Yang
Publisher:
Published: 2001
Total Pages: 664
ISBN-13:
DOWNLOAD EBOOKRead and Download eBook Full
Author: Ming Yang
Publisher:
Published: 2001
Total Pages: 664
ISBN-13:
DOWNLOAD EBOOKAuthor: Ming Yang
Publisher:
Published: 2001
Total Pages: 688
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 2003
Total Pages: 920
ISBN-13:
DOWNLOAD EBOOKAuthor: Yikai Zhou
Publisher: SPIE-International Society for Optical Engineering
Published: 2001
Total Pages: 514
ISBN-13:
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Publisher:
Published: 2002
Total Pages: 106
ISBN-13:
DOWNLOAD EBOOKAuthor: International Conference on Semiconductor Technology
Publisher:
Published: 2001
Total Pages: 646
ISBN-13: 9781566773232
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 2003
Total Pages: 926
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 2002
Total Pages: 194
ISBN-13:
DOWNLOAD EBOOKAuthor: Banqiu Wu
Publisher: McGraw Hill Professional
Published: 2011-07-07
Total Pages: 544
ISBN-13: 007174195X
DOWNLOAD EBOOKThe latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology