Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment
Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment

Author: Denis Flandre

Publisher: Springer Science & Business Media

Published: 2006-05-06

Total Pages: 358

ISBN-13: 1402030134

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This proceedings volume archives the contributions of the speakers who attended the NATO Advanced Research Workshop on “Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment” held at the Sanatorium Puscha Ozerna, th th Kyiv, Ukraine, from 25 to 29 April 2004. The semiconductor industry has maintained a very rapid growth during the last three decades through impressive technological achievements which have resulted in products with higher performance and lower cost per function. After many years of development semiconductor-on-insulator materials have entered volume production and will increasingly be used by the manufacturing industry. The wider use of semiconductor (especially silicon) on insulator materials will not only enable the benefits of these materials to be further demonstrated but, also, will drive down the cost of substrates which, in turn, will stimulate the development of other novel devices and applications. In itself this trend will encourage the promotion of the skills and ideas generated by researchers in the Former Soviet Union and Eastern Europe and their incorporation in future collaborations.

Progress in SOI Structures and Devices Operating at Extreme Conditions
Progress in SOI Structures and Devices Operating at Extreme Conditions

Author: Francis Balestra

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 349

ISBN-13: 9401003394

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A review of the electrical properties, performance and physical mechanisms of the main silicon-on-insulator (SOI) materials and devices. Particular attention is paid to the reliability of SOI structures operating in harsh conditions. The first part of the book deals with material technology and describes the SIMOX and ELTRAN technologies, the smart-cut technique, SiCOI structures and MBE growth. The second part covers reliability of devices operating under extreme conditions, with an examination of low and high temperature operation of deep submicron MOSFETs and novel SOI technologies and circuits, SOI in harsh environments and the properties of the buried oxide. The third part deals with the characterization of advanced SOI materials and devices, covering laser-recrystallized SOI layers, ultrashort SOI MOSFETs and nanostructures, gated diodes and SOI devices produced by a variety of techniques. The last part reviews future prospects for SOI structures, analyzing wafer bonding techniques, applications of oxidized porous silicon, semi-insulating silicon materials, self-organization of silicon dots and wires on SOI and some new physical phenomena.

High Temperature Electronics Design for Aero Engine Controls and Health Monitoring
High Temperature Electronics Design for Aero Engine Controls and Health Monitoring

Author: Lucian Stoica

Publisher: CRC Press

Published: 2022-09-01

Total Pages: 161

ISBN-13: 1000795454

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There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include:• High temperature electronics market• High temperature devices, materials and assembly processes• Design, manufacture and testing of multi-sensor data acquisition system for aero-engine control• Future applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering.

Porous Silicon: From Formation to Applications: Optoelectronics, Microelectronics, and Energy Technology Applications, Volume Three
Porous Silicon: From Formation to Applications: Optoelectronics, Microelectronics, and Energy Technology Applications, Volume Three

Author: Ghenadii Korotcenkov

Publisher: CRC Press

Published: 2016-01-06

Total Pages: 620

ISBN-13: 1498782558

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Porous silicon is rapidly attracting increasing interest from various fields, including optoelectronics, microelectronics, photonics, medicine, sensor and energy technologies, chemistry, and biosensing. This nanostructured and biodegradable material has a range of unique properties that make it ideal for many applications. This book, the third of a

Handbook of Silicon Based MEMS Materials and Technologies
Handbook of Silicon Based MEMS Materials and Technologies

Author: Markku Tilli

Publisher: Elsevier

Published: 2020-04-17

Total Pages: 1028

ISBN-13: 012817787X

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Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors

Materials for Modern Technologies
Materials for Modern Technologies

Author: Yue Li

Publisher: Trans Tech Publications Ltd

Published: 2014-04-22

Total Pages: 338

ISBN-13: 3038264385

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Selected, peer reviewed papers from the 2014 Spring International Conference on Material Sciences and Technology (MST-S), April 16-18, 2014, Shanghai, China

Harsh Environment Electronics
Harsh Environment Electronics

Author: Ahmed Sharif

Publisher: John Wiley & Sons

Published: 2019-08-05

Total Pages: 398

ISBN-13: 3527344195

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Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

High Temperature Electronics
High Temperature Electronics

Author: K. Fricke

Publisher: Elsevier Publishing Company

Published: 1995

Total Pages: 262

ISBN-13:

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These proceedings review the state of the art in the field of semiconductor materials for high temperature application. Areas examined include: the material quality of SiC; crystalline and polycrystalline diamond; and the problems of material growth.