Reliability Prediction for Microelectronics
Reliability Prediction for Microelectronics

Author: Joseph B. Bernstein

Publisher: John Wiley & Sons

Published: 2024-02-20

Total Pages: 404

ISBN-13: 1394210930

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RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.

Reliability Prediction from Burn-In Data Fit to Reliability Models
Reliability Prediction from Burn-In Data Fit to Reliability Models

Author: Joseph Bernstein

Publisher: Academic Press

Published: 2014-03-06

Total Pages: 108

ISBN-13: 0128008199

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This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. - The ability to include reliability calculations and test results in their product design - The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions - Have accurate failure rate calculations for calculating warrantee period replacement costs

Reliability Prediction and Testing Textbook
Reliability Prediction and Testing Textbook

Author: Lev M. Klyatis

Publisher: John Wiley & Sons

Published: 2018-07-12

Total Pages: 289

ISBN-13: 1119411939

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This textbook reviews the methodologies of reliability prediction as currently used in industries such as electronics, automotive, aircraft, aerospace, off-highway, farm machinery, and others. It then discusses why these are not successful; and, presents methods developed by the authors for obtaining accurate information for successful prediction. The approach is founded on approaches that accurately duplicate the real world use of the product. Their approach is based on two fundamental components needed for successful reliability prediction; first, the methodology necessary; and, second, use of accelerated reliability and durability testing as a source of the necessary data. Applicable to all areas of engineering, this textbook details the newest techniques and tools to achieve successful reliabilityprediction and testing. It demonstrates practical examples of the implementation of the approaches described. This book is a tool for engineers, managers, researchers, in industry, teachers, and students. The reader will learn the importance of the interactions of the influencing factors and the interconnections of safety and human factors in product prediction and testing.

Reliability Prediction for Microelectronics
Reliability Prediction for Microelectronics

Author: Joseph B. Bernstein

Publisher: John Wiley & Sons

Published: 2024-02-13

Total Pages: 404

ISBN-13: 1394210957

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RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.

Reliability and Physics-of-Healthy in Mechatronics
Reliability and Physics-of-Healthy in Mechatronics

Author: Abdelkhalak El Hami

Publisher: John Wiley & Sons

Published: 2023-01-12

Total Pages: 324

ISBN-13: 1786308819

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This book illustrates simply, but with many details, the state of the art of reliability science, exploring clear reliability disciplines and applications through concrete examples from their industries and from real life, based on industrial experiences. Many experts believe that reliability is not only a matter of statistics but is a multidisciplinary scientific topic, involving materials, tests, simulations, quality tools, manufacturing, electronics, mechatronics, environmental engineering and Big Data, among others. For a complex mechatronic system, failure risks have to be identified at an early stage of the design. In the automotive and aeronautic industries, fatigue simulation is used both widely and efficiently. Problems arise from the variability of inputs such as fatigue parameters and life curves. This book aims to discuss probabilistic fatigue and reliability simulation. To do this, Reliability and Physics-of-Healthy in Mechatronics provides a study on some concepts of a predictive reliability model of microelectronics, with examples from the automotive, aeronautic and space industries, based on entropy and Physics-of-Healthy

Reliability Growth
Reliability Growth

Author: Panel on Reliability Growth Methods for Defense Systems

Publisher: National Academy Press

Published: 2015-03-01

Total Pages: 235

ISBN-13: 9780309314749

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A high percentage of defense systems fail to meet their reliability requirements. This is a serious problem for the U.S. Department of Defense (DOD), as well as the nation. Those systems are not only less likely to successfully carry out their intended missions, but they also could endanger the lives of the operators. Furthermore, reliability failures discovered after deployment can result in costly and strategic delays and the need for expensive redesign, which often limits the tactical situations in which the system can be used. Finally, systems that fail to meet their reliability requirements are much more likely to need additional scheduled and unscheduled maintenance and to need more spare parts and possibly replacement systems, all of which can substantially increase the life-cycle costs of a system. Beginning in 2008, DOD undertook a concerted effort to raise the priority of reliability through greater use of design for reliability techniques, reliability growth testing, and formal reliability growth modeling, by both the contractors and DOD units. To this end, handbooks, guidances, and formal memoranda were revised or newly issued to reduce the frequency of reliability deficiencies for defense systems in operational testing and the effects of those deficiencies. "Reliability Growth" evaluates these recent changes and, more generally, assesses how current DOD principles and practices could be modified to increase the likelihood that defense systems will satisfy their reliability requirements. This report examines changes to the reliability requirements for proposed systems; defines modern design and testing for reliability; discusses the contractor's role in reliability testing; and summarizes the current state of formal reliability growth modeling. The recommendations of "Reliability Growth" will improve the reliability of defense systems and protect the health of the valuable personnel who operate them.

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Author: E-H Wong

Publisher: Woodhead Publishing

Published: 2015-05-23

Total Pages: 477

ISBN-13: 0857099116

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study