Reliability of the Scanning Capacitance Microscopy and Spectroscopy for the Nanoscale Characterization of Semiconductors and Dielectrics
Reliability of the Scanning Capacitance Microscopy and Spectroscopy for the Nanoscale Characterization of Semiconductors and Dielectrics

Author: Octavian Ligor

Publisher:

Published: 2010

Total Pages: 190

ISBN-13:

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This work was devoted to the experimental study of the scanning capacitance microscopy (SCM) and spectroscopy (SCS) for the mapping of the dopants in the semiconductor structures and for the characterization of thin oxides. SCM has appeared to be a very powerful technique for doping mapping as long as qualitative images are needed, for example in order to check whether fabrication steps like implantations have been correctly operated during the fabrication of devices (presence or absence of doping of a given type in a region where it should be present). When quantitativity is needed, the only way of performing a calibration of SCM images for dopant mapping seems to grow exactly the same oxide on two different samples, one being a calibration sample from which a semi-calibration curve associating doping levels and SCM signal levels will be measured and applied to the unknown sample (semi-calibration). We have shown the capabilities of SCM for dopant mapping using a series of experimental situations and test samples covering almost all frequently encountered structures in the industry of silicon microelectronics : doping staircases of p-type and n-type structures, quantum wells and p-n junctions. Qualitative images have been obtained for a wide range of doping levels between 2.e+15 at.cm-3 to 5.e+19 at.cm-3. SCM is able to detect quantum wells of ~ 7 nm width. SCM is also able to differentiate between dopants of different type (p-type or n-type). All these results confirm the usefulness of SCM as a qualitative imaging technique. We have studied the experimental parameters playing a role in the interpretation and reproducibility of SCM signal: stray light, stray capacitance, the tip-sample contact, the influence of strong electrical fields, the sample's topography, the quality and the properties of the top oxide. We have proposed solutions for eliminating all these parasitic factors and for rendering the SCM measurements reproducible and quantitative.

Materials and Reliability Handbook for Semiconductor Optical and Electron Devices
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices

Author: Osamu Ueda

Publisher: Springer Science & Business Media

Published: 2012-09-22

Total Pages: 618

ISBN-13: 1461443377

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Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.

Scanning Nonlinear Dielectric Microscopy
Scanning Nonlinear Dielectric Microscopy

Author: Yasuo Cho

Publisher: Woodhead Publishing

Published: 2020-05-20

Total Pages: 258

ISBN-13: 0081028032

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Scanning Nonlinear Dielectric Microscopy: Investigation of Ferroelectric, Dielectric, and Semiconductor Materials and Devices is the definitive reference on an important tool to characterize ferroelectric, dielectric and semiconductor materials. Written by the inventor, the book reviews the methods for applying the technique to key materials applications, including the measurement of ferroelectric materials at the atomic scale and the visualization and measurement of semiconductor materials and devices at a high level of sensitivity. Finally, the book reviews new insights this technique has given to material and device physics in ferroelectric and semiconductor materials. The book is appropriate for those involved in the development of ferroelectric, dielectric and semiconductor materials devices in academia and industry. Presents an in-depth look at the SNDM materials characterization technique by its inventor Reviews key materials applications, such as measurement of ferroelectric materials at the nanoscale and measurement of semiconductor materials and devices Analyzes key insights on semiconductor materials and device physics derived from the SNDM technique

Scanning Capacitance Microscopy
Scanning Capacitance Microscopy

Author: Wolfgang Brezna

Publisher: Sudwestdeutscher Verlag Fur Hochschulschriften AG

Published: 2009-01

Total Pages: 156

ISBN-13: 9783838102672

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In this PhD-thesis, Scanning Capacitance Microscopy (SCM) and Scanning Capacitance Spectroscopy (SCS) was applied to investigate various silicon samples. SCM is used to investigate the electrical behaviour of samples with a lateral resolution below 100 nm. The work is divided into 3 major experimental parts: (1) the properties of metal organic chemical vapour deposited zirconium dioxide as dielectric material for SCM was explored. Usage of zirconium dioxide leads to reduced leakage currents and improved signal quality. (2) focussed ion beam induced damage in silicon was investigated with SCM. The beam shape and the range of ion damage inside the sample was investigated. The SCM data were compared with transmission electron microscopy data. (3) a setup for quantitative Scanning Capacitance Spectroscopy with an external capacitance bridge connected to an atomic force microscope was designed. This setup is sensitive enough to resolve the energetic distribution of interface trapped charges and to quantitatively measure the local oxide charge density distribution of zirconium dioxide layers.

Applied Scanning Probe Methods VIII
Applied Scanning Probe Methods VIII

Author: Bharat Bhushan

Publisher: Springer Science & Business Media

Published: 2007-12-20

Total Pages: 512

ISBN-13: 3540740805

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The volumes VIII, IX and X examine the physical and technical foundation for recent progress in applied scanning probe techniques. This is the first book to summarize the state-of-the-art of this technique. The field is progressing so fast that there is a need for a set of volumes every 12 to 18 months to capture latest developments. These volumes constitute a timely comprehensive overview of SPM applications.

Scanning Probe Characterization of Novel Semiconductor Materials and Devices
Scanning Probe Characterization of Novel Semiconductor Materials and Devices

Author: Xiaotian Zhou

Publisher:

Published: 2007

Total Pages: 127

ISBN-13: 9789984343143

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As semiconductor devices shrink in size, it becomes more important to characterize and understand electronic properties of the materials and devices at the nanoscale. Scanning probe techniques offers numerous advantages over traditional tools used for semiconductor materials and devices characterization including high spatial resolution, ease of use and multi-functionality for electrical characterization, such as current, potential and capacitance, etc.

Microscopy of Semiconducting Materials 2007
Microscopy of Semiconducting Materials 2007

Author: A.G. Cullis

Publisher: Springer Science & Business Media

Published: 2008-12-02

Total Pages: 504

ISBN-13: 1402086156

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This volume contains invited and contributed papers presented at the conference on ‘Microscopy of Semiconducting Materials’ held at the University of Cambridge on 2-5 April 2007. The event was organised under the auspices of the Electron Microscopy and Analysis Group of the Institute of Physics, the Royal Microscopical Society and the Materials Research Society. This international conference was the fifteenth in the series that focuses on the most recent world-wide advances in semiconductor studies carried out by all forms of microscopy and it attracted delegates from more than 20 countries. With the relentless evolution of advanced electronic devices into ever smaller nanoscale structures, the problem relating to the means by which device features can be visualised on this scale becomes more acute. This applies not only to the imaging of the general form of layers that may be present but also to the determination of composition and doping variations that are employed. In view of this scenario, the vital importance of transmission and scanning electron microscopy, together with X-ray and scanning probe approaches can immediately be seen. The conference featured developments in high resolution microscopy and nanoanalysis, including the exploitation of recently introduced aberration-corrected electron microscopes. All associated imaging and analytical techniques were demonstrated in studies including those of self-organised and quantum domain structures. Many analytical techniques based upon scanning probe microscopies were also much in evidence, together with more general applications of X-ray diffraction methods.