This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Discusses the application of computer-aided and analytical methods and approaches of materials science and engineering mechanics to evaluating and assuring the short-term and long-term reliability of materials and structures in photonics engineering. The main concern is the mechanical reliability of the system and the impact of the mechanical behavior of photonics material and structures on the system's optical performance. The 49 papers cover general problems, strength degradation, fatigue and ageing in the materials, the structural analysis and modelling of the mechanical behavior, high- strength and metallized fibers, performance in harsh environments, and the reliability of devices. Annotation copyrighted by Book News, Inc., Portland, OR
In developing III-V optical devices for use in optical fiber communication systems, digital-audio systems, and optical printers, reliability is paramount. Understanding the origins and causes of degradation is critical to successful design. This unique book focuses specifically on helping researchers and engineers involved in III-V compound semiconductor thin film growth and processing better understand the mechanism of degradation and details the major degradation modes of optical devices fabricated from three different systems. The book explains the character of defects and imperfections induced during material growth and fabrication, presents techniques for failure analysis, and describes methods for elimination of defect-generating mechanisms. More than 200 illustrations and 40 equations help clarify important concepts.
Organized by the International Association for Structural Control(IASC), and sponsored by the European Association for the Controlof Structures (EACS), the recent world conference on structuralcontrol (3WCSC) brought together engineers, scientists, architects,builders and other practitioners interested in the general fieldsof active, hybrid and passive vibration control, health monitoringand damage detection, intelligent/smart materials and systems.Applications included buildings, bridges, space structures andcivil infrastructures under the action of dynamic environments(earthquake, wind, traffic...) and man-made loads. It provideda valuable forum for the discussion of the most pressing concernsin structural control and its related topics. The conference covered a wide range of topics including activeand semi-active control devices, passive control devices, controlalgorithms for linear and non-linear systems, modeling andidentification of structural systems, sensors, health monitoringand damage detection, benchmark test of building and bridges,innovative materials for structural control, applications toaerospace structures, applications to bridges, applications tocritical structures, external dynamic force characteristics andcontrollability issues, implications of severe ground motions, windforces, codes for structural control, and so forth. Suchcomprehensive treatment of the most innovative developments instructural control will make these volumes an informative referencefor all researchers and engineers interested in this area. Proceedings of the US - Europe Workshop On Sensors andSmart Structures Technology Como and Somma Lombardo, Italy In the last few years, significant progress has been made in thearea of sensing technology and structural healthmonitoring/condition assessment in the US and Europe. Innovativeconcepts involving new hardware, algorithms, and software have beenproposed. There have also been several full-scale trialimplementations of densely sensor-instrumented infrastructures andhealth monitoring systems, as well as case studies on bridges inEurope and in the US. Much can be learnt through US/European collaboration in the areaof experimental verification on small, medium, large and full-scaleprojects. Moreover, a common framework for expanded future jointresearch can be developed on the increased understanding achievedthrough mutual learning. This workshop consisted of seminar sessions on several themeswhich included innovative sensing hardware, advances in wirelesstechnology, and damage detection/characterization and conditionassessment methodologies. In addition, there were several workshopsessions devoted to summarizing the status of the sensors and smartstructures technologies in these topics, identifying the compellingresearch issues, and formulating an action plan withrecommendations for development and implementation through possiblecollaborative research projects and sharing of scientific data.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
