Properties of Lead-Bismuth, Lead-Tin, Type Metal, and Fusible Alloys (Classic Reprint)

Properties of Lead-Bismuth, Lead-Tin, Type Metal, and Fusible Alloys (Classic Reprint)

Author: J. G. Thompson

Publisher: Forgotten Books

Published: 2017-10-28

Total Pages: 26

ISBN-13: 9780266885788

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Excerpt from Properties of Lead-Bismuth, Lead-Tin, Type Metal, and Fusible Alloys The experimental data show a gradual decrease of elongation with increasing bismuth content, then irregularity in the same region of the limit of solid solubility, and a final rise after the solid solubility is definitely exceeded. Elongation results on cast specimens tend to be irregular as they are influenced by minor imperfections in the castings to a greater degree than are either the tensile strength or hardness. The hardness data show an increase in hardness with increasing bismuth up to about 20 per cent, followed by practically constant values from 20 to 45 per cent, with a final rise at the end of the curve. Irregularities in the region of 30 and 35 per cent are not so pronounced as in the other curves. A few experiments on the susceptibility of these alloys to heat treat ment or to precipitation hardening were performed. Standard - inch test bars were examined in the following conditions: As cast; cast and aged at room temperature; quenched in ice water from 120° C. And pulled immediately; quenched in ice water and aged 24 hours; and annealed by heating to 1200 C. For two hours, fol lowed by slow cooling to room temperature. N 0 significant differ ences were established between the as cast and the cast and aged at room temperature specimens during periods of aging extending up to seven months. The results of the tensile strength determina tions on these heat-treated specimens are shown graphically in Fig ure 4. N o appreciable variation in results, below 35 per cent bismuth. About the Publisher Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.


Engineering Properties and Applications of Lead Alloys

Engineering Properties and Applications of Lead Alloys

Author: Sivaraman Guruswamy

Publisher: CRC Press

Published: 1999-11-09

Total Pages: 658

ISBN-13: 9780824782474

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Focusing on the uses of lead in pure or alloy form for engineering applications, this text presents data on the physical, mechanical, corrosive, accoustic, damping and nuclear properties of lead and lead alloys. It organizes information according to alloy type in tables, graphs and text, and examines the processing of commercially available lead products, including casting, rolling, extrusion, machining, welding and mechanical joining techniques.


Materials Handbook

Materials Handbook

Author: John A. Vaccari

Publisher: McGraw Hill Professional

Published: 2002-07-09

Total Pages: 1244

ISBN-13: 9780071501842

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The Materials Handbook is an encyclopedic, A-to-Z organization of all types of materials, featuring their key performance properties, principal characteristics and applications in product design. Materials include ferrous and nonferrous metals, plastics, elastomers, ceramics, woods, composites, chemicals, minerals, textiles, fuels, foodstuffs and natural plant and animal substances --more than 13,000 in all. Properties are expressed in both U.S. customary and metric units and a thorough index eases finding details on each and every material. Introduced in 1929 and often known simply as "Brady's," this comprehensive, one-volume, 1244 page encyclopedia of materials is intended for executives, managers, supervisors, engineers, and technicians, in engineering, manufacturing, marketing, purchasing and sales as well as educators and students. Of the dozens of families of materials updated in the 15th Edition, the most extensive additions pertain to adhesives, activated carbon, aluminides, aluminum alloys, catalysts, ceramics, composites, fullerences, heat-transfer fluids, nanophase materials, nickel alloys, olefins, silicon nitride, stainless steels, thermoplastic elastomers, titanium alloys, tungsten alloys, valve alloys and welding and hard-facing alloys. Also widely updated are acrylics, brazing alloys, chelants, biodegradable plastics, molybdenum alloys, plastic alloys, recyclate plastics, superalloys, supercritical fluids and tool steels. New classes of materials added include aliphatic polyketones, carburizing secondary-hardening steels and polyarylene ether benzimidazoles. Carcinogens and materials likely to be cancer-causing in humans are listed for the first time.


Solder Joint Reliability

Solder Joint Reliability

Author: John H. Lau

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 649

ISBN-13: 1461539102

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Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.