Dielectric Spectroscopy of Electronic Materials
Dielectric Spectroscopy of Electronic Materials

Author: Yuriy Poplavko

Publisher: Woodhead Publishing

Published: 2021-07-06

Total Pages: 377

ISBN-13: 0128236442

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Dielectric Spectroscopy of Electronic Materials: Applied Physics of Dielectrics incorporates the results of four decades of research and applications of dielectric spectroscopy for solids, mostly for the investigation of materials used in electronics. The book differs from others by more detailed analysis of the features of dielectric spectra conditioned by specific mechanisms of electrical polarization and conductivity. Some original methods are presented in the simulation of frequency distributions (relaxers and oscillators), with methods proposed for various ferroelectrics frequency-temperature dielectric spectra. Also described are original methods for ferroelectrics on microwaves investigation, including the features of thin films study. The book is not burdened by complex mathematical proofs and should help readers quickly understand how to apply dielectric spectroscopy methods to their own research problems. More advanced readers may also find this book valuable as a review of the key concepts and latest advances on the topics presented. - Introduces critical material characterization techniques by an expert with more than 40 years of experience in dielectric spectroscopy - Reviews advances in dielectric spectroscopy methods to enable advances such as the miniaturization of electronics at the nanoscale - Provides an overview of polarization mechanisms utilizing different models (i.e., oscillator and relaxation)

Electronic Materials
Electronic Materials

Author: N. Hannay

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 646

ISBN-13: 1461568900

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This volume constitutes the written proceedings of the Third International Conference on Materials SCience, held under the sponsorship of the Accademia Nazionale dei Lincei as the XIII summer course of the G. Donegani Foundation at Tremezzo, Italy, on September 4-15, 1972. The course of lectures was designed for scientists and engineers "d th a ,wrking knowledge of electronic materials, who sought to extend their knowledge of the newest developments in the field. The rapid pace of research and exploratory development in electronic materials has led to a preSSing need for continuing awareness and assessment of new electronic materials, as well as renewal of information in the more traditional areas. Three classes of electronic materials were selected for the course. Semiconductors provide the foundation for solid state electronics and semiconductor devices represent the most sophisti cated and advanced application of materials science and engineering known to modern technology. Yet, the march of progress in semi conductors continues ,unabated - new semiconductor materials are in the research stage, new process technology is being developed, and new devices are being conceived. The second class of materials dealt with in the course, magnetic alloys and insulators, also has a firm application base; for example, computer performance is often measured in terms of the size of the magnetic memory. The tailoring of materials to provide particular combinations of desired magnetic properties is an integral part of the development of the electronics, just as in the case of semiconductors.

Electronic Materials Handbook
Electronic Materials Handbook

Author:

Publisher: ASM International

Published: 1989-11-01

Total Pages: 1234

ISBN-13: 9780871702852

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Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Fatigue of Electronic Materials
Fatigue of Electronic Materials

Author: Scott A. Schroeder

Publisher: ASTM International

Published: 1994

Total Pages: 154

ISBN-13: 0803119941

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Unlike earlier electronic circuits, today's microelectronic devices demand that solder serve structural as well as electrical ends, and do so at relatively high temperature for years. Fatigue and failure of the solder has therefore become an issue in the industry. Nine studies from a May 1993 sympos

Proceedings of the 1st International Conference on Electronic Engineering and Renewable Energy
Proceedings of the 1st International Conference on Electronic Engineering and Renewable Energy

Author: Bekkay Hajji

Publisher: Springer

Published: 2018-08-01

Total Pages: 786

ISBN-13: 9811314055

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The proceedings present a selection of refereed papers presented at the 1st International Conference on Electronic Engineering and Renewable Energy (ICEERE 2018) held during 15-17 April 2018, Saidi, Morocco. The contributions from electrical engineers and experts highlight key issues and developments essential to the multifaceted field of electrical engineering systems and seek to address multidisciplinary challenges in Information and Communication Technologies. The book has a special focus on energy challenges for developing the Euro-Mediterranean regions through new renewable energy technologies in the agricultural and rural areas. The book is intended for academia, including graduate students, experienced researchers and industrial practitioners working in the fields of Electronic Engineering and Renewable Energy.

Advanced Nanodielectrics
Advanced Nanodielectrics

Author: Toshikatsu Tanaka

Publisher: CRC Press

Published: 2017-07-06

Total Pages: 312

ISBN-13: 1351862979

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This book is the translated version of Advanced Nanodielectrics: Fundamentals and Applications, which was published by the Investigating R&D Committee on Advanced Polymer Nanocomposite Dielectrics of the Institute of Electrical Engineers of Japan (IEEJ). The Japanese version is a winner of the IEEJ Outstanding Technical Report Award (2016). Nanocomposites are generally composed of host and guest materials. This book deals with the combination of a polymer as a host with an inorganic filler as a guest. It provides a detailed coverage on the processing and electrical properties of nanocomposites. It gives special consideration to the surface modification of particles, theoretical aspects of the interface, and computer simulation to help the reader develop an understanding of the characteristics of nanocomposites. Moreover, it discusses potential applications of nanocomposites in electric power and electronics sectors. The book is a definitive and practical handbook for beginners as well as experts.

Semiconductor Advanced Packaging
Semiconductor Advanced Packaging

Author: John H. Lau

Publisher: Springer Nature

Published: 2021-05-17

Total Pages: 513

ISBN-13: 9811613761

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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.