The proceedings present a selection of refereed papers presented at the 1st International Conference on Electronic Engineering and Renewable Energy (ICEERE 2018) held during 15-17 April 2018, Saidi, Morocco. The contributions from electrical engineers and experts highlight key issues and developments essential to the multifaceted field of electrical engineering systems and seek to address multidisciplinary challenges in Information and Communication Technologies. The book has a special focus on energy challenges for developing the Euro-Mediterranean regions through new renewable energy technologies in the agricultural and rural areas. The book is intended for academia, including graduate students, experienced researchers and industrial practitioners working in the fields of Electronic Engineering and Renewable Energy.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
This volume constitutes the written proceedings of the Third International Conference on Materials SCience, held under the sponsorship of the Accademia Nazionale dei Lincei as the XIII summer course of the G. Donegani Foundation at Tremezzo, Italy, on September 4-15, 1972. The course of lectures was designed for scientists and engineers "d th a ,wrking knowledge of electronic materials, who sought to extend their knowledge of the newest developments in the field. The rapid pace of research and exploratory development in electronic materials has led to a preSSing need for continuing awareness and assessment of new electronic materials, as well as renewal of information in the more traditional areas. Three classes of electronic materials were selected for the course. Semiconductors provide the foundation for solid state electronics and semiconductor devices represent the most sophisti cated and advanced application of materials science and engineering known to modern technology. Yet, the march of progress in semi conductors continues ,unabated - new semiconductor materials are in the research stage, new process technology is being developed, and new devices are being conceived. The second class of materials dealt with in the course, magnetic alloys and insulators, also has a firm application base; for example, computer performance is often measured in terms of the size of the magnetic memory. The tailoring of materials to provide particular combinations of desired magnetic properties is an integral part of the development of the electronics, just as in the case of semiconductors.
Dielectric Spectroscopy of Electronic Materials: Applied Physics of Dielectrics incorporates the results of four decades of research and applications of dielectric spectroscopy for solids, mostly for the investigation of materials used in electronics. The book differs from others by more detailed analysis of the features of dielectric spectra conditioned by specific mechanisms of electrical polarization and conductivity. Some original methods are presented in the simulation of frequency distributions (relaxers and oscillators), with methods proposed for various ferroelectrics frequency-temperature dielectric spectra. Also described are original methods for ferroelectrics on microwaves investigation, including the features of thin films study. The book is not burdened by complex mathematical proofs and should help readers quickly understand how to apply dielectric spectroscopy methods to their own research problems. More advanced readers may also find this book valuable as a review of the key concepts and latest advances on the topics presented. - Introduces critical material characterization techniques by an expert with more than 40 years of experience in dielectric spectroscopy - Reviews advances in dielectric spectroscopy methods to enable advances such as the miniaturization of electronics at the nanoscale - Provides an overview of polarization mechanisms utilizing different models (i.e., oscillator and relaxation)
This book presents high-quality peer-reviewed papers from the International Conference on Electronics, Biomedical Engineering, and Health Informatics (ICEBEHI) 2022 held at Surabaya, Indonesia, virtually. The contents are broadly divided into three parts: (a) Electronics, (b) Biomedical Engineering, and (c) Health Informatics. The major focus is on emerging technologies and their applications in the domain of biomedical engineering. It includes papers based on original theoretical, practical, and experimental simulations, development, applications, measurements, and testing. Featuring the latest advances in the field of biomedical engineering applications, this book serves as a definitive reference resource for researchers, professors, and practitioners interested in exploring advanced techniques in the fields of electronics, biomedical engineering, and health informatics. The applications and solutions discussed here provide excellent reference material for future product development.
Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Comprising two volumes, Thermoelectrics and Its Energy Harvesting reviews the vast improvements in technology and application of thermoelectric energy with a specific intention to reduce and reuse waste heat and improve novel techniques for the efficient acquisition and use of energy.Materials, Preparation, and Characterization in Thermoelectrics i
