The Best of ICCAD
The Best of ICCAD

Author: Andreas Kuehlmann

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 699

ISBN-13: 1461502926

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In 2002, the International Conference on Computer Aided Design (ICCAD) celebrates its 20th anniversary. This book commemorates contributions made by ICCAD to the broad field of design automation during that time. The foundation of ICCAD in 1982 coincided with the growth of Large Scale Integration. The sharply increased functionality of board-level circuits led to a major demand for more powerful Electronic Design Automation (EDA) tools. At the same time, LSI grew quickly and advanced circuit integration became widely avail able. This, in turn, required new tools, using sophisticated modeling, analysis and optimization algorithms in order to manage the evermore complex design processes. Not surprisingly, during the same period, a number of start-up com panies began to commercialize EDA solutions, complementing various existing in-house efforts. The overall increased interest in Design Automation (DA) re quired a new forum for the emerging community of EDA professionals; one which would be focused on the publication of high-quality research results and provide a structure for the exchange of ideas on a broad scale. Many of the original ICCAD volunteers were also members of CANDE (Computer-Aided Network Design), a workshop of the IEEE Circuits and Sys tem Society. In fact, it was at a CANDE workshop that Bill McCalla suggested the creation of a conference for the EDA professional. (Bill later developed the name).

Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology
Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology

Author: Luciano Lavagno

Publisher: CRC Press

Published: 2017-02-03

Total Pages: 893

ISBN-13: 1351831003

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The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs
Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs

Author: Balsha R. Stanisic

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 221

ISBN-13: 1461313996

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In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.

Defect and Fault Tolerance in VLSI Systems
Defect and Fault Tolerance in VLSI Systems

Author: C.H. Stapper

Publisher: Springer Science & Business Media

Published: 2013-06-29

Total Pages: 313

ISBN-13: 1475799578

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Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an "International Workshop on Designing for Yield" at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the "IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems" in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.

Testability Concepts for Digital ICs
Testability Concepts for Digital ICs

Author: F.P.M. Beenker

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 216

ISBN-13: 1461523656

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Preface Testing Integrated Circuits for manufacturing defects includes four basic disciplines. First of all an understanding of the origin and behaviour of defects. Secondly, knowledge of IC design and IC design styles. Thirdly, knowledge of how to create a test program for an IC which is targeted on detecting these defects, and finally, understanding of the hardware, Automatic Test Equipment, to run the test on. All four items have to be treated, managed, and to a great extent integrated before the term 'IC quality' gets a certain meaning and a test a certain measurable value. The contents of this book reflects our activities on testability concepts for complex digital ICs as performed at Philips Research Laboratories in Eindhoven, The Netherlands. Based on the statements above, we have worked along a long term plan, which was based on four pillars. 1. The definition of a test methodology suitable for 'future' IC design styles, 2. capable of handling improved defect models, 3. supported by software tools, and 4. providing an easy link to Automatic Test Equipment. The reasoning we have followed was continuously focused on IC qUality. Quality expressed in terms of the ability of delivering a customer a device with no residual manufacturing defects. Bad devices should not escape a test. The basis of IC quality is a thorough understanding of defects and defect models.

EDA for IC Implementation, Circuit Design, and Process Technology
EDA for IC Implementation, Circuit Design, and Process Technology

Author: Luciano Lavagno

Publisher: CRC Press

Published: 2018-10-03

Total Pages: 608

ISBN-13: 1420007955

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Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.