ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

Author:

Publisher: ASM International

Published: 2019-12-01

Total Pages: 540

ISBN-13: 1627082735

DOWNLOAD EBOOK

The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.


Silicon-on-Insulator Technology: Materials to VLSI

Silicon-on-Insulator Technology: Materials to VLSI

Author: J.-P. Colinge

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 375

ISBN-13: 1441991069

DOWNLOAD EBOOK

Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis.


Istfa 2005

Istfa 2005

Author: ASM International

Publisher: ASM International

Published: 2005-01-01

Total Pages: 524

ISBN-13: 1615030883

DOWNLOAD EBOOK


ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis

ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis

Author: ASM International

Publisher: ASM International

Published: 2018-12-01

Total Pages: 593

ISBN-13: 1627080996

DOWNLOAD EBOOK

The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.


Microelectronics Failure Analysis

Microelectronics Failure Analysis

Author:

Publisher: ASM International

Published: 2004-01-01

Total Pages: 813

ISBN-13: 0871708043

DOWNLOAD EBOOK

For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron


ISTFA 2006

ISTFA 2006

Author: Electronic Device Failure Analysis Society

Publisher: ASM International

Published: 2006

Total Pages: 524

ISBN-13: 1615030891

DOWNLOAD EBOOK