Advanced Topics In Microelectronics And System Design

Advanced Topics In Microelectronics And System Design

Author: Giuseppe Ferla

Publisher: World Scientific

Published: 2000-12-13

Total Pages: 265

ISBN-13: 9814492167

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This volume covers a wide area — from research topics to the design and improvement of integrated circuit devices, already existing or to be introduced to the market.


Test and Design-for-Testability in Mixed-Signal Integrated Circuits

Test and Design-for-Testability in Mixed-Signal Integrated Circuits

Author: Jose Luis Huertas Díaz

Publisher: Springer Science & Business Media

Published: 2010-02-23

Total Pages: 310

ISBN-13: 0387235213

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Test and Design-for-Testability in Mixed-Signal Integrated Circuits deals with test and design for test of analog and mixed-signal integrated circuits. Especially in System-on-Chip (SoC), where different technologies are intertwined (analog, digital, sensors, RF); test is becoming a true bottleneck of present and future IC projects. Linking design and test in these heterogeneous systems will have a tremendous impact in terms of test time, cost and proficiency. Although it is recognized as a key issue for developing complex ICs, there is still a lack of structured references presenting the major topics in this area. The aim of this book is to present basic concepts and new ideas in a manner understandable for both professionals and students. Since this is an active research field, a comprehensive state-of-the-art overview is very valuable, introducing the main problems as well as the ways of solution that seem promising, emphasizing their basis, strengths and weaknesses. In essence, several topics are presented in detail. First of all, techniques for the efficient use of DSP-based test and CAD test tools. Standardization is another topic considered in the book, with focus on the IEEE 1149.4. Also addressed in depth is the connecting design and test by means of using high-level (behavioural) description techniques, specific examples are given. Another issue is related to test techniques for well-defined classes of integrated blocks, like data converters and phase-locked-loops. Besides these specification-driven testing techniques, fault-driven approaches are described as they offer potential solutions which are more similar to digital test methods. Finally, in Design-for-Testability and Built-In-Self-Test, two other concepts that were taken from digital design, are introduced in an analog context and illustrated for the case of integrated filters. In summary, the purpose of this book is to provide a glimpse on recent research results in the area of testing mixed-signal integrated circuits, specifically in the topics mentioned above. Much of the work reported herein has been performed within cooperative European Research Projects, in which the authors of the different chapters have actively collaborated. It is a representative snapshot of the current state-of-the-art in this emergent field.


I-Bytes Technology Industry

I-Bytes Technology Industry

Author: IT-Shades

Publisher: EGBG Services LLC

Published: 2020-09-10

Total Pages: 95

ISBN-13:

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This document brings together a set of latest data points and publicly available information relevant for Technology Industry. We are very excited to share this content and believe that readers will benefit from this periodic publication immensely.


Leveraging Transdisciplinary Engineering in a Changing and Connected World

Leveraging Transdisciplinary Engineering in a Changing and Connected World

Author: P. Koomsap

Publisher: IOS Press

Published: 2023-11-14

Total Pages: 964

ISBN-13: 1643684418

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Simple problems have become rare in today’s technologically advanced world. Problems are typically much more complex, and solving them requires integrative knowledge from several disciplines. Technology alone cannot be the answer. Collaborative teams equipped with knowledge and skills in various disciplines are indispensable to exploit technologies effectively and create new conceptual, theoretical, methodological, and translational innovations that integrate and move beyond discipline-specific approaches to address a common problem in the changing and connected world. This book presents the proceedings of TE2023, the 30th International Conference on Transdisciplinary Engineering, held in Hua Hin Cha Am, Thailand from 11-14 July 2023. The theme of this year’s conference was Leveraging Transdisciplinary Engineering in a Changing and Connected World, and it provided a forum for more than 115 participants from academia and industry to exchange knowledge and ideas connected to this aspect of transdisciplinary engineering. A total of 117 submissions were received for the conference, of which 93 were selected for presentation and publication here following a rigorous abstract and full-paper review process. They are arranged under 7 categories: product design and development; team working; smart operations for value chain management; transdisciplinary approaches; engineering education; critical issues in transdisciplinary engineering; and theoretical contributions. Providing a comprehensive overview of the latest innovations and ideas in transdisciplinary engineering, the book will be of interest to all those working in the field.


T Bytes Hybrid Cloud Infrastructure

T Bytes Hybrid Cloud Infrastructure

Author: IT-Shades

Publisher: EGBG Services LLC

Published: 2020-09-30

Total Pages: 162

ISBN-13:

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This document brings together a set of latest data points and publicly available information relevant for Hybrid Cloud Infrastructure Industry. We are very excited to share this content and believe that readers will benefit from this periodic publication immensely.


Metal Additive Manufacturing

Metal Additive Manufacturing

Author: Dyuti Sarker

Publisher: John Wiley & Sons

Published: 2021-10-26

Total Pages: 624

ISBN-13: 1119210836

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METAL ADDITIVE MANUFACTURING A comprehensive review of additive manufacturing processes for metallic structures Additive Manufacturing (AM)—also commonly referred to as 3D printing—builds three-dimensional objects by adding materials layer by layer. Recent years have seen unprecedented investment in additive manufacturing research and development by governments and corporations worldwide. This technology has the potential to replace many conventional manufacturing processes, enable the development of new industry practices, and transform the entire manufacturing enterprise. Metal Additive Manufacturing provides an up-to-date review of all essential physics of metal additive manufacturing techniques with emphasis on both laser-based and non-laser-based additive manufacturing processes. This comprehensive volume covers fundamental processes and equipment, governing physics and modelling, design and topology optimization, and more. The text adresses introductory, intermediate, and advanced topics ranging from basic additive manufacturing process classification to practical and material design aspects of additive manufacturability. Written by a panel of expert authors in the field, this authoritative resource: Provides a thorough analysis of AM processes and their theoretical foundations Explains the classification, advantages, and applications of AM processes Describes the equipment required for different AM processes for metallic structures, including laser technologies, positioning devices, feeder and spreader mechanisms, and CAD software Discusses the opportunities, challenges, and current and emerging trends within the field Covers practical considerations, including design for AM, safety, quality assurance, automation, and real-time control of AM processes Includes illustrative cases studies and numerous figures and tables Featuring material drawn from the lead author’s research and professional experience on laser additive manufacturing, Metal Additive Manufacturing is an important source for manufacturing professionals, research and development engineers in the additive industry, and students and researchers involved in mechanical, mechatronics, automatic control, and materials engineering and science.


Bulletin

Bulletin

Author: Bombay (Presidency). Dept. of Land Records and Agriculture

Publisher:

Published: 1927

Total Pages: 384

ISBN-13:

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