This book provides an introductory treatment of ternary equilibrium diagrams. It presents case studies in the field of metallurgy and material science. It is useful for undergraduates and postgraduates and scientists, who wish to acquire an understanding of ternary phase diagrams.
The book comprises three parts. Part 1 gives a historical description of the development of ironworking techniques since the earliest times. Part 2 is the core of the book and deals with the metallurgical basis of microstructures, with four main themes: phase diagrams, solidification processes, diffusion, and solid state phase transformations. Part 3 begins by an introduction to steel design principles. It then goes on to consider the different categories of steels, placing emphasis on their specific microstructural features. Finally, a comprehensive reference list includes several hundred pertinent articles and books. The book is the work of a single author, thus ensuring uniformity and concision. It is intended for scientists, metallurgical engineers and senior technicians in research and development laboratories, design offices and quality departments, as well as for teachers and students in universities, technical colleges and other higher education establishments.
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.