Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Author: Ephraim Suhir

Publisher: Springer Science & Business Media

Published: 2007-05-26

Total Pages: 1471

ISBN-13: 0387329897

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This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Optoelectronic Integration: Physics, Technology and Applications
Optoelectronic Integration: Physics, Technology and Applications

Author: Osamu Wada

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 464

ISBN-13: 1461526868

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As we approach the end of the present century, the elementary particles of light (photons) are seen to be competing increasingly with the elementary particles of charge (electrons/holes) in the task of transmitting and processing the insatiable amounts of infonnation needed by society. The massive enhancements in electronic signal processing that have taken place since the discovery of the transistor, elegantly demonstrate how we have learned to make use of the strong interactions that exist between assemblages of electrons and holes, disposed in suitably designed geometries, and replicated on an increasingly fine scale. On the other hand, photons interact extremely weakly amongst themselves and all-photonic active circuit elements, where photons control photons, are presently very difficult to realise, particularly in small volumes. Fortunately rapid developments in the design and understanding of semiconductor injection lasers coupled with newly recognized quantum phenomena, that arise when device dimensions become comparable with electronic wavelengths, have clearly demonstrated how efficient and fast the interaction between electrons and photons can be. This latter situation has therefore provided a strong incentive to devise and study monolithic integrated circuits which involve both electrons and photons in their operation. As chapter I notes, it is barely fifteen years ago since the first demonstration of simple optoelectronic integrated circuits were realised using m-V compound semiconductors; these combined either a laser/driver or photodetector/preamplifier combination.

Optoelectronic Packaging
Optoelectronic Packaging

Author: Alan R. Mickelson

Publisher: Wiley-Interscience

Published: 1997-05-05

Total Pages: 0

ISBN-13: 9780471111887

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The missing link in a dynamically growing field--a state-of-the-artreference on optoelectronic packaging The rapidly expanding field of packaging for optoelectronic deviceschallenges electrical engineers with a host of complex and dauntingproblems. The increasing intricacy of assemblage compounds thethorny interconnection issues associated with electronicpackaging-how to assemble an array with many elements efficientlywhile maintaining thermal tolerance and simultaneously overcomingthe ensuing modulation problems that generate electrical noise.Adding to these problems has been the absence, until now, of asingle authoritative reference on the subject. Optoelectronic Packaging is the first and only comprehensivesourcebook on optoelectronic assembly techniques. Foroptoelectronic packaging experts and professionals in adjuncttechnologies, it provides an overview of today's state-of-the-arttechnologies, packages now on the drawing board, and the futuredirection of packaging types. For the novice, it lays down thefundamentals of optics and packaging. This incomparable textfeatures contributions from hands-on practitioners and,supplemented with extensive illustrations, it * Covers detector, semiconductor laser, and optical amplifierpackaging * Discusses waveguide technologies, free-space interconnects, andhybrid technologies * Examines communication system interconnection structure andfiber-optic networks in telecommunications * Explores array device packaging and flip-chip assembly for smartpixel arrays * Includes case studies of packaged subassemblies

Optoelectronic Interconnects and Packaging
Optoelectronic Interconnects and Packaging

Author: Ray T. Chen

Publisher: SPIE-International Society for Optical Engineering

Published: 1996

Total Pages: 476

ISBN-13:

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Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

Handbook of Optoelectronics (Two-Volume Set)
Handbook of Optoelectronics (Two-Volume Set)

Author: John P. Dakin

Publisher: CRC Press

Published: 2006-05-17

Total Pages: 832

ISBN-13: 9780750306461

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A field as diverse as optoelectronics needs a reference that is equally versatile. From basic physics and light sources to devices and state-of-the-art applications, the Handbook of Optoelectronics provides comprehensive, self-contained coverage of fundamental concepts and practical applications across the entire spectrum of disciplines encompassed by optoelectronics. The handbook unifies a broad array of current research areas with a forward-looking focus on systems and applications. Beginning with an introduction to the relevant principles of physics, materials science, engineering, and optics, the book explores the details of optoelectronic devices and techniques including semiconductor lasers, optical detectors and receivers, optical fiber devices, modulators, amplifiers, integrated optics, LEDs, and engineered optical materials. Applications and systems then become the focus, with sections devoted to industrial, medical, and commercial applications, communications, imaging and displays, sensing and data processing, spectroscopic analysis, the art of practical optoelectronics, and future prospects. This extensive resource comprises the efforts of more than 70 world-renowned experts from leading industrial and academic institutions around the world and includes many references to contemporary works. Whether used as a field reference, as a research tool, or as a broad and self-contained introduction to the field, the Handbook of Optoelectronics places everything you need in a unified, conveniently organized format.

Introduction to Microsystem Packaging Technology
Introduction to Microsystem Packaging Technology

Author: Yufeng Jin

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 232

ISBN-13: 1439865973

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The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.