Microelectronics Packaging Handbook
Microelectronics Packaging Handbook

Author: Rao Tummala

Publisher: Springer Science & Business Media

Published: 1997-01-31

Total Pages: 662

ISBN-13: 9780412084515

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This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Microelectronics Packaging Handbook
Microelectronics Packaging Handbook

Author: R.R. Tummala

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 1060

ISBN-13: 1461560373

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Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Microelectronics Fialure Analysis Desk Reference, Seventh Edition
Microelectronics Fialure Analysis Desk Reference, Seventh Edition

Author: Tejinder Gandhi

Publisher: ASM International

Published: 2019-11-01

Total Pages: 719

ISBN-13: 1627082468

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The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.

The Recognition of Speech by Machine
The Recognition of Speech by Machine

Author: Arthur S. House

Publisher:

Published: 1988

Total Pages: 520

ISBN-13:

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This bibliography aims to provide an easily accessible and thus convenient reference source for all those with an interest in automatic speech recognition and speech technology. The coverage is extensive and up-to-date and provides a historical perspective, as well as a reference point for recent work. Whether it is used merely to check references or as a starting point for an exploration of this field of research, this volume will prove an invaluable addition to any personal or institutional library.

Nanotechnology and Microelectronics: Global Diffusion, Economics and Policy
Nanotechnology and Microelectronics: Global Diffusion, Economics and Policy

Author: Ekekwe, Ndubuisi

Publisher: IGI Global

Published: 2010-06-30

Total Pages: 537

ISBN-13: 1616920076

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"This book assesses the state of nanotechnology and microelectronics, and examines many issues, such as climate change, trade, innovation, diffusion, etc, with a theme focused on facilitating the structures for the adoption and penetration of the technologies into developing nations"--Provided by publisher.

Microelectronics Failure Analysis
Microelectronics Failure Analysis

Author:

Publisher: ASM International

Published: 2004-01-01

Total Pages: 813

ISBN-13: 0871708043

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For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron

Building Tomorrow: Innovation in Construction and Engineering
Building Tomorrow: Innovation in Construction and Engineering

Author: André Manseau

Publisher: Routledge

Published: 2019-09-17

Total Pages: 184

ISBN-13: 135195413X

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In the past decade construction and engineering have changed dramatically, with an explosion of innovative new approaches to construction and new methodologies. By bringing together economic, social and construction/engineering management perspectives, this book offers a unique and comprehensive survey of these approaches and techniques. It presents a history of studies in innovation in construction and engineering, and then presents the most recent models of innovation brokering and risk-management, based on complex project-based industries. Innovation is defined and competing theories are discussed in the light of operational issues. The book covers all aspects, including the importance of construction and engineering 'cultures' in the trades for successful project innovation. It also discusses the role of government and policy makers, the implications of rapid change for the building trades and skilled labour, and the difficulty of measuring innovation quantitatively.