Materials Reliability in Microelectronics VI: Volume 428
Materials Reliability in Microelectronics VI: Volume 428

Author: William F. Filter

Publisher:

Published: 1996-11-18

Total Pages: 616

ISBN-13:

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MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.

Low-Dielectric Constant Materials II: Volume 443
Low-Dielectric Constant Materials II: Volume 443

Author: André Lagendijk

Publisher:

Published: 1997-08-19

Total Pages: 224

ISBN-13:

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Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.

Materials Issues in Art and Archaeology V: Volume 462
Materials Issues in Art and Archaeology V: Volume 462

Author: Pamela B. Vandiver

Publisher:

Published: 1997-10-15

Total Pages: 464

ISBN-13:

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This book presents cutting-edge multidisciplinary work on the characterization of ancient materials; the technologies of selection, production and usage by which materials are transformed into objects and artifacts; the science underlying their deterioration, preservation and conservation; and sociocultural interpretation derived from an empirical methodology of observation, measurement and experimentation. Of particular interest are contributions which explore the interface and overlap among traditional materials science, the history of technology and the archaeological and conservation sciences, or that investigate new methods and applications of materials science in art and archaeology. Topics include: analytical chemistry and spectroscopy; ancient and historical metallurgy; natural and artificial glass; characterization, sources and production of ceramics; organic materials technologies; architectural conservation and materials characterization; conservation of archaeological and historical materials; and other studies of ceramics and metals.

Materials for Mechanical and Optical Microsystems: Volume 444
Materials for Mechanical and Optical Microsystems: Volume 444

Author: Michael L. Reed

Publisher:

Published: 1997-03-30

Total Pages: 264

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A selection of 33 reviewed papers explore the materials aspects of microsystems, especially those involving mechanical, optical, and thermal components. The topics include technology for micro- assembling, selective electroless copper metallization of epoxy substrates, an improved auto-adhesion measurement method for micro-machines polysilicon beams, patterned sol-gel structures by micro-molding in capillaries, the experimental analysis of the process of anodic bonding using an evaporated glass layer, the effect of inorganic thin film material processing and properties on stress in silicon piezoresistive pressure sensors, and photoconductivity in vacuum-deposited films of silicon-based polymers. Annotation copyrighted by Book News, Inc., Portland, OR

Solid State Chemistry of Inorganic Materials: Volume 453
Solid State Chemistry of Inorganic Materials: Volume 453

Author: Peter K. Davies

Publisher:

Published: 1997-06-02

Total Pages: 776

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The importance and scope of solid-state chemistry has grown in response to the continuing challenge to understand, control and predict the structures and properties of solids at the atomic level, and to synthesize new compounds with enhanced physical response. The many successes in the preparation of materials with unique electronic, optical, magnetic and catalytic properties are a clear testament to the vitality and importance of solid-state chemistry to materials research. This book provides an interdisciplinary forum for discussion and exchange of ideas on both the recent advances in solid-state chemistry and their impact on the development and application of inorganic materials. Topics include: chalcogenides; synthesis and reactivity; materials synthesis; theory; optical properties; electronic and magnetic properties; dielectrics and ferroelectrics; solid-state ionics and surfaces and interfaces.

Thin Films Stresses and Mechanical Properties VI
Thin Films Stresses and Mechanical Properties VI

Author: William W. Gerberich

Publisher:

Published: 1997

Total Pages: 576

ISBN-13:

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Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.