Direct-Write Technologies covers applications, materials, and the techniques in using direct-write technologies. This book provides an overview of the different direct write techniques currently available, as well as a comparison between the strengths and special attributes for each of the techniques. The techniques described open the door for building prototypes and testing materials. The book also provides an overview of the state-of-the-art technology involved in this field. Basic academic researchers and industrial development engineers who pattern thin film materials will want to have this text on their shelves as a resource for specific applications. Others in this or related fields will want the book to read the introductory material summarizing isuses common to all approaches, in order to compare and contrast different techniques. Everyday applications include electronic components and sensors, especially chemical and biosensors. There is a wide range of research and development problems requiring state-of-the-art direct write tools. This book will appeal to basic researchers and development engineers in university engineering departments and at industrial and national research laboratories. This text should appeal equally well in the United States, Asia, and Europe. Both basic academic researchers and industrial development engineers who pattern thin film materials will want to have this text on their shelves as a resource for specific applications. An overview of the different direct write techniques currently available A comparison between the strengths and special attributes for each of the techniques An overview of the state-of-the-art technology involved in this field
This book covers in detail the various aspects of joining materials to form parts. A conceptual overview of rapid prototyping and layered manufacturing is given, beginning with the fundamentals so that readers can get up to speed quickly. Unusual and emerging applications such as micro-scale manufacturing, medical applications, aerospace, and rapid manufacturing are also discussed. This book provides a comprehensive overview of rapid prototyping technologies as well as support technologies such as software systems, vacuum casting, investment casting, plating, infiltration and other systems. This book also: Reflects recent developments and trends and adheres to the ASTM, SI, and other standards Includes chapters on automotive technology, aerospace technology and low-cost AM technologies Provides a broad range of technical questions to ensure comprehensive understanding of the concepts covered
Microchemical Engineering in Practice provides the information chemists and engineers need to evaluate the use of microreactors, covering the technical, operational, and economic considerations for various applications. It explains the systems needed to use microreactors in production and presents examples of microreactor use in different chemistries, including larger scale production processes. There are guidelines on calculating the costs and the risks of production using continuous flow microreactors. Complete with case studies, this is an essential guide for chemists and engineers interested in investigating the advantages of chemical microreactors.
These 38 papers from the April 2000 symposium study granular structure, granular flows, nonlinear waves in granular media, vibrated and rotated granular media, and stress distributions. Topics include jamming in liquids and granular materials, nuclear magnetic resonance studies of granular flows, the blueprint of a concept for a nozzle- free inkjet printer, mixing and segregation processes in a Turbula blender, persistence of granular structure during die compaction of ceramic powders, and humidity-induced cohesion effects in granular media. c. Book News Inc.
Interest in wide-bandgap semiconductors for high-power/high-temperature electronics remains prominent. For such applications, SiC is by far the most mature semiconductor material. GaN and diamond, however, have also become prime candidates. While diamond has several advantages over the other two materials, producing large single crystals, as well as the inability to achieve n-type doping, have limited device fabrication. For GaN, recent advances in crystal growth and processing capabilities, as well as excellent transport properties, have yielded a great deal of device development, yet thermal conduction remains an issue. SiC has excellent thermal conductivity, high-breakdown voltages, and well-developed substrates and processing techniques. This book deals with a wide range of technical activity in the area of wide-bandgap high-power/high-temperature electronic devices and covers topics including the fabrication and performance of GaN-based and SiC-based devices, as well as issues related to growth, characterization, and processing of wide-bandgap materials. Several summaries of the current status of the field are provided.