Challenges In Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 2
Challenges In Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 2

Author: Bonnie Antoun

Publisher: Springer Science & Business Media

Published: 2013-08-28

Total Pages: 184

ISBN-13: 3319008528

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Challenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 2: Proceedings of the 2013 SEM Annual Conference& Exposition on Experimental and Applied Mechanics, the second volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Experimental Mechanics, including papers in the following general technical research areas: Metallic, Polymeric and Composite Materials Effects of Extreme Environments including Radiation Resistance, Damage, and Aging Challenges in Time-dependent Behavior Modeling of Low, Moderate and High Strain Rates Effects of Frequency and Hysteretic Heating Effects of Inhomogeneities on the Time-Dependent Behavior Composite, Hybrid and Multifunctional Materials Challenges in Time-dependent Behavior Modeling Viscoelastoplasticity and Damage Effects of Interfaces and Interphases on the Time-Dependent Behavior Environmental and Reactive Property Change Effects on Thermomechanical and Multifunctional Behaviors Modeling and Characterization of Fabrication Processes of Conventional and Multifunctional Materials Time-dependent and Small-scale Effects in Micro/Nano-scale Testing Time-dependent Processes in Biomaterials

Materials and Processes for Next Generation Lithography
Materials and Processes for Next Generation Lithography

Author:

Publisher: Elsevier

Published: 2016-11-08

Total Pages: 636

ISBN-13: 0081003587

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As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography. These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches. This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication. - Assembles up-to-date information from the world's premier resist chemists and technique development lithographers on the properties and capabilities of the wide range of resist materials currently under investigation - Includes information on processing and metrology techniques - Brings together multiple approaches to litho pattern recording from academia and industry in one place

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)

Author:

Publisher: World Scientific

Published: 2019-08-27

Total Pages: 1079

ISBN-13: 9811209642

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Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.

Challenges In Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 2
Challenges In Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 2

Author: Bonnie Antoun

Publisher: Springer

Published: 2016-08-23

Total Pages: 0

ISBN-13: 9783319376233

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Challenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 2: Proceedings of the 2013 SEM Annual Conference& Exposition on Experimental and Applied Mechanics, the second volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Experimental Mechanics, including papers in the following general technical research areas: Metallic, Polymeric and Composite Materials Effects of Extreme Environments including Radiation Resistance, Damage, and Aging Challenges in Time-dependent Behavior Modeling of Low, Moderate and High Strain Rates Effects of Frequency and Hysteretic Heating Effects of Inhomogeneities on the Time-Dependent Behavior Composite, Hybrid and Multifunctional Materials Challenges in Time-dependent Behavior Modeling Viscoelastoplasticity and Damage Effects of Interfaces and Interphases on the Time-Dependent Behavior Environmental and Reactive Property Change Effects on Thermomechanical and Multifunctional Behaviors Modeling and Characterization of Fabrication Processes of Conventional and Multifunctional Materials Time-dependent and Small-scale Effects in Micro/Nano-scale Testing Time-dependent Processes in Biomaterials

Engineering Materials and Processes Desk Reference
Engineering Materials and Processes Desk Reference

Author: Michael F. Ashby

Publisher: Butterworth-Heinemann

Published: 2009-01-06

Total Pages: 543

ISBN-13: 0080878393

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A one-stop desk reference, for engineers involved in the use of engineered materials across engineering and electronics, this book will not gather dust on the shelf. It brings together the essential professional reference content from leading international contributors in the field. Material ranges from basic to advanced topics, including materials and process selection and explanations of properties of metals, ceramics, plastics and composites. - A hard-working desk reference, providing all the essential material needed by engineers on a day-to-day basis - Fundamentals, key techniques, engineering best practice and rules-of-thumb together in one quick-reference sourcebook - Definitive content by the leading authors in the field, including Michael Ashby, Robert Messler, Rajiv Asthana and R.J. Crawford

Materials and Process Modeling of Aerospace Composites
Materials and Process Modeling of Aerospace Composites

Author: Charles Lu

Publisher: SAE International

Published: 2019-04-30

Total Pages: 190

ISBN-13: 0768001900

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Since the successful production of carbon fibers in early 1960s, composite materials have emerged as the materials of choice for general aviation aircraft, military aircraft, space launch vehicles, and unmanned air vehicles. This has revolutionized the aerospace industry due to their excellent mechanical and physical properties, as well as weight-reducing ability. The next- generation material development model should operate in an integrated computational environment, where new material development, manufacturability, and product design practice are seamlessly interconnected. Materials and Process Modeling of Aerospace Composites reports recent developments on materials and processes of aerospace composites by using computational modeling, covering the following aspects: • The historical uses of composites in aerospace industry, documenting in detail the early usage of composite materials on Premier I by Raytheon to recent full-scale applications of composites on large commercial aircraft by Boeing and Airbus. • An overview on the classifications of composites used in aerospace industry, ranging from conventional glass- fiber reinforced composites to advanced graphene nanocomposites. • The recent work on computational material engineering on aerospace composite materials, including fundamental computational frame work and case studies on the modeling of materials and processes

Materials Science and Technology
Materials Science and Technology

Author: National Research Council

Publisher: National Academies Press

Published: 2003-05-16

Total Pages: 98

ISBN-13: 030916804X

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The report assesses the current state of chemistry and chemical engineering at the interface with materials science and identifies challenges for research. Recent advances are blurring the distinction between chemistry and materials science and are enabling the creation of new materials that, to date, have only been predicted by theory. These advances include a greater ability to construct materials from molecular components, to design materials for a desired function, to understand molecular "self-assembly, and to improve processes by which the material is "engineered" into the final product.