Magnetic Materials Processes and Devices 11
Magnetic Materials Processes and Devices 11

Author: S. Krongelb

Publisher: The Electrochemical Society

Published: 2011-03

Total Pages: 127

ISBN-13: 1566778921

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The Eleventh International Symposium on Magnetic Materials, Processes and Devices was held on Monday and Tuesday, October 11 and 12, 2010 as part of the 218th Meeting of Electrochemical Society in Las Vegas, Nevada. This international Symposium included presentations by 59 authors and co-authors from Canada, Germany, Italy, Japan, Korea, Norway and the United States.

Magnetic Materials, Processes, and Devices 9
Magnetic Materials, Processes, and Devices 9

Author:

Publisher: The Electrochemical Society

Published: 2007

Total Pages: 444

ISBN-13: 1566775604

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This issue documents the state of the field in magnetic thin film processing using electrochemical methods including film nucleation and growth, structure of deposits, stress and micromagnetics of films, thermal and magnetic annealing, electrochemical and electroless plating systems, etching, process chemistry, tool design, and process control.

Magnetic Materials, Processes, and Devices 10
Magnetic Materials, Processes, and Devices 10

Author: S. Krongelb

Publisher: The Electrochemical Society

Published: 2009-05

Total Pages: 318

ISBN-13: 1566777305

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This issue of ECS Transactions brings together the work of electrochemists, physicists, engineers, and device designers working in the area of magnetic thin-film technology. Topics include electrochemical and electroless plating systems, etching, process chemistry, tool design, process control, film nucleation and growth, structure of deposits, stress, physics and micromagnetics of films, thermal and magnetic annealing. Applications include the fabrication of data recording systems, sensors, microelectrochemical systems (MEMS) and other magnetic devices.

Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications

Author: F. Roozeboom

Publisher: The Electrochemical Society

Published: 2011-04-25

Total Pages: 377

ISBN-13: 1566778638

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This issue of ECS Transactions covers emerging materials, process and technology options for large-area silicon wafers to enhance advanced IC performance or to enable revolutionary device structures with entirely new functionalities. Topics : high-mobility channel materials, (e.g. strained Si/Ge, compound semiconductors and graphene), high-performance gate stacks and low-resistivity junctions and contacts on new, Si-compatible materials; new materials and processes for 3-D (TSV) integration ; synthesis of nano-structures including wires, pores and membranes of Si-compatible materials; novel MEMS/NEMS structures and their integration with the mainstream Si-IC technology.