Scientific and Technical Aerospace Reports
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Published: 1984
Total Pages: 1278
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Author:
Publisher:
Published: 1984
Total Pages: 1278
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 1984
Total Pages: 1144
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 1984
Total Pages: 996
ISBN-13:
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Published: 1984
Total Pages: 1528
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DOWNLOAD EBOOKAuthor: Randall L. Geiger
Publisher: McGraw-Hill Companies
Published: 1990
Total Pages: 1010
ISBN-13:
DOWNLOAD EBOOKAuthor: Clive Maxfield
Publisher: Newnes
Published: 2008-12-05
Total Pages: 567
ISBN-13: 0080949509
DOWNLOAD EBOOKThis entertaining and readable book provides a solid, comprehensive introduction to contemporary electronics. It's not a "how-to-do" electronics book, but rather an in-depth explanation of how today's integrated circuits work, how they are designed and manufactured, and how they are put together into powerful and sophisticated electronic systems. In addition to the technical details, it's packed with practical information of interest and use to engineers and support personnel in the electronics industry. It even tells how to pronounce the alphabet soup of acronyms that runs rampant in the industry. - Written in conversational, fun style that has generated a strong following for the author and sales of over 14,000 copies for the first two editions - The Third Edition is even bigger and better, with lots of new material, illustrations, and an expanded glossary - Ideal for training incoming engineers and technicians, and for people in marketing or other related fields or anyone else who needs to familiarize themselves with electronics terms and technology
Author: Sung-Mo Kang
Publisher:
Published: 2002
Total Pages: 655
ISBN-13: 9780071243421
DOWNLOAD EBOOKThe fourth edition of CMOS Digital Integrated Circuits: Analysis and Design continues the well-established tradition of the earlier editions by offering the most comprehensive coverage of digital CMOS circuit design, as well as addressing state-of-the-art technology issues highlighted by the widespread use of nanometer-scale CMOS technologies. In this latest edition, virtually all chapters have been re-written, the transistor model equations and device parameters have been revised to reflect the sigificant changes that must be taken into account for new technology generations, and the material has been reinforced with up-to-date examples. The broad-ranging coverage of this textbook starts with the fundamentals of CMOS process technology, and continues with MOS transistor models, basic CMOS gates, interconnect effects, dynamic circuits, memory circuits, arithmetic building blocks, clock and I/O circuits, low power design techniques, design for manufacturability and design for testability.
Author: John E. Ayers
Publisher: CRC Press
Published: 2018-09-03
Total Pages: 468
ISBN-13: 1420069888
DOWNLOAD EBOOKExponential improvement in functionality and performance of digital integrated circuits has revolutionized the way we live and work. The continued scaling down of MOS transistors has broadened the scope of use for circuit technology to the point that texts on the topic are generally lacking after a few years. The second edition of Digital Integrated Circuits: Analysis and Design focuses on timeless principles with a modern interdisciplinary view that will serve integrated circuits engineers from all disciplines for years to come. Providing a revised instructional reference for engineers involved with Very Large Scale Integrated Circuit design and fabrication, this book delves into the dramatic advances in the field, including new applications and changes in the physics of operation made possible by relentless miniaturization. This book was conceived in the versatile spirit of the field to bridge a void that had existed between books on transistor electronics and those covering VLSI design and fabrication as a separate topic. Like the first edition, this volume is a crucial link for integrated circuit engineers and those studying the field, supplying the cross-disciplinary connections they require for guidance in more advanced work. For pedagogical reasons, the author uses SPICE level 1 computer simulation models but introduces BSIM models that are indispensable for VLSI design. This enables users to develop a strong and intuitive sense of device and circuit design by drawing direct connections between the hand analysis and the SPICE models. With four new chapters, more than 200 new illustrations, numerous worked examples, case studies, and support provided on a dynamic website, this text significantly expands concepts presented in the first edition.
Author: Marin Alexe
Publisher: Springer Science & Business Media
Published: 2004-05-14
Total Pages: 524
ISBN-13: 9783540210498
DOWNLOAD EBOOKDuring the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.