Thirty-fourth International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher: ASM International
Published: 2008-01-01
Total Pages: 551
ISBN-13: 1615030913
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Author: ASM International
Publisher: ASM International
Published: 2008-01-01
Total Pages: 551
ISBN-13: 1615030913
DOWNLOAD EBOOKAuthor:
Publisher: ASM International
Published: 2009-01-01
Total Pages: 371
ISBN-13: 1615030921
DOWNLOAD EBOOKThis volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
Author: ASM International
Publisher: ASM International
Published: 2007-01-01
Total Pages: 372
ISBN-13: 1615030905
DOWNLOAD EBOOKPrintbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Author: A. S. M. International
Publisher: ASM International
Published: 2013-01-01
Total Pages: 634
ISBN-13: 1627080228
DOWNLOAD EBOOKThis volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Author: ASM International
Publisher: ASM International
Published: 2019-12-01
Total Pages: 540
ISBN-13: 1627082735
DOWNLOAD EBOOKThe theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
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Publisher: ASM International
Published: 2011
Total Pages: 479
ISBN-13: 1615038507
DOWNLOAD EBOOKAuthor: ASM International
Publisher: ASM International
Published: 2017-12-01
Total Pages: 666
ISBN-13: 1627081518
DOWNLOAD EBOOKThe theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
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Publisher: ASM International
Published: 2010-01-01
Total Pages: 487
ISBN-13: 1615037276
DOWNLOAD EBOOKAuthor: ASM International
Publisher: ASM International
Published: 2018-12-01
Total Pages: 593
ISBN-13: 1627080996
DOWNLOAD EBOOKThe International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Author: ASM International
Publisher: ASM International
Published: 2012
Total Pages: 643
ISBN-13: 1615039953
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