High Power Impulse Magnetron Sputtering: Fundamentals, Technologies, Challenges and Applications is an in-depth introduction to HiPIMS that emphasizes how this novel sputtering technique differs from conventional magnetron processes in terms of both discharge physics and the resulting thin film characteristics. Ionization of sputtered atoms is discussed in detail for various target materials. In addition, the role of self-sputtering, secondary electron emission and the importance of controlling the process gas dynamics, both inert and reactive gases, are examined in detail with an aim to generate stable HiPIMS processes. Lastly, the book also looks at how to characterize the HiPIMS discharge, including essential diagnostic equipment. Experimental results and simulations based on industrially relevant material systems are used to illustrate mechanisms controlling nucleation kinetics, column formation and microstructure evolution.
This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips.For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verified numerical models that provide in-depth insight into the design and operation I-PVD tools.Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference.Key Features:The first comprehensive volume on ionized physical vapor depositionCombines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVDEmphasizes practical applications in the area of IC fabrication and interconnect technologyServes as a guide to select the most appropriate technology for any deposition application*This single source saves time and effort by including comprehensive information at one's finger tips*The integration of tool design, process development, and fundamental physics allows the reader to quickly understand all of the issues important to I-PVD*The numerous practical applications assist the working engineer to select and refine thin film processes
This book addresses the need for improved diagnostic and treatment guidelines for patients in whom total knee arthroplasty (TKA) has had an unsatisfactory outcome. It opens by discussing the basics of TKA and the various causes of failure and pain. Diagnostic aspects are considered in detail, with attention to advances in clinical investigation, laboratory analysis and in particular, imaging techniques. In addition, helpful state of the art diagnostic algorithms are presented. Specific pathology-related treatment options, including conservative approaches and salvage and revision TKA strategies, are then explained, with identification of pitfalls and key points. A series of illustrative cases cover clinical scenarios frequently encountered in daily clinical practice. The evidence-based, clinically focused guidance provided in this book, written by internationally renowned experts, will assist surgeons in achieving the most effective management of these challenging cases.
Reflecting the fast pace of research in the field, the Second Edition of Bulk Metallic Glasses has been thoroughly updated and remains essential reading on the subject. It incorporates major advances in glass forming ability, corrosion behavior, and mechanical properties. Several of the newly proposed criteria to predict the glass-forming ability of alloys have been discussed. All other areas covered in this book have been updated, with special emphasis on topics where significant advances have occurred. These include processing of hierarchical surface structures and synthesis of nanophase composites using the chemical behavior of bulk metallic glasses and the development of novel bulk metallic glasses with high-strength and high-ductility and superelastic behavior. New topics such as high-entropy bulk metallic glasses, nanoporous alloys, novel nanocrystalline alloys, and soft magnetic glassy alloys with high saturation magnetization have also been discussed. Novel applications, such as metallic glassy screw bolts, surface coatings, hyperthermia glasses, ultra-thin mirrors and pressure sensors, mobile phone casing, and degradable biomedical materials, are described. Authored by the world’s foremost experts on bulk metallic glasses, this new edition endures as an indispensable reference and continues to be a one-stop resource on all aspects of bulk metallic glasses.
This is a comprehensive description of the theoretical foundations and experimental applications of spectroscopic methods in plasma physics research. It introduces the classical and quantum theory of radiation, with detailed descriptions of line strengths and high density effects, and describes theoretical and experimental aspects of spectral line broadening. The book illustrates the concepts of continuous spectra, level kinetics and cross sections, thermodynamic equilibrium relations, radiative energy transfer, and radiative energy losses. The basics of plasma spectroscopy to density and temperature measurements and to the determination of some other plasma properties are also explored. Over one thousand references not only guide the reader to original research covered in the chapters, but also to experimental details and instrumentation.
In this valuable work, all aspects of the reactive magnetron sputtering process, from the discharge up to the resulting thin film growth, are described in detail, allowing the reader to understand the complete process. Hence, this book gives necessary information for those who want to start with reactive magnetron sputtering, understand and investigate the technique, control their sputtering process and tune their existing process, obtaining the desired thin films.
Diffusion Barrier Stack - 5 nm -3 nm -2 nm :. . . -. . . . : . . O. 21-lm Figure 2: Schematic representing a cross-sectional view of the topography that is encountered in the processing of integrated circuits. (Not to scale) these sub-micron sized features is depicted in Fig. 2. The role of the diffusion barrier is to prevent the diffusion of metallic ions into the interlayer dielectric (lLD). Depending on the technology, in particular the choice of the ILD and the metal interconnect, the diffusion barrier may be Ti, Ta, TiN, TaN, or a multi-layered structure of these materials. The adhesion of the barrier to the dielectric, the conformality of the barrier to the feature, the physical structure of the film, and the chemical composition of the film are key issues that are determined in part by the nature of the deposition process. Likewise, after the growth of the barrier, a conducting layer (the seed layer) is needed for subsequent filling of the trench by electrochemical deposition. Again, the growth process must be able to deposit a film that is continuous along the topography of the sub-micron sized features. Other factors of concern are the purity and the texture of the seed layer, as both of these factors influence the final resistivity of the metallic interconnect. Sputter-deposited coatings are also commonly employed for their electro-optical properties. For example, an electrochromic glazing is used to control the flux of light that is transmitted through a glazed material.
Throughout most of the twentieth century, electric propulsion was considered the technology of the future. Now, the future has arrived. This important new book explains the fundamentals of electric propulsion for spacecraft and describes in detail the physics and characteristics of the two major electric thrusters in use today, ion and Hall thrusters. The authors provide an introduction to plasma physics in order to allow readers to understand the models and derivations used in determining electric thruster performance. They then go on to present detailed explanations of: Thruster principles Ion thruster plasma generators and accelerator grids Hollow cathodes Hall thrusters Ion and Hall thruster plumes Flight ion and Hall thrusters Based largely on research and development performed at the Jet Propulsion Laboratory (JPL) and complemented with scores of tables, figures, homework problems, and references, Fundamentals of Electric Propulsion: Ion and Hall Thrusters is an indispensable textbook for advanced undergraduate and graduate students who are preparing to enter the aerospace industry. It also serves as an equally valuable resource for professional engineers already at work in the field.
Superlubricity is defined as a sliding regime in which friction or resistance to sliding vanishes. It has been shown that energy can be conserved by further reducing/removing friction in moving mechanical systems and this book includes contributions from world-renowned scientists who address some of the most fundamental research issues in overcoming friction. Superlubricity reviews the latest methods and materials in this area of research that are aimed at removing friction in nano-to-micro scale machines and large scale engineering components. Insight is also given into the atomic-scale origins of friction in general and superlubricity while other chapters focus on experimental and practical aspects or impacts of superlubricity that will be very useful for broader industrial community.* Reviews the latest fundamental research in superlubricity today* Presents 'state-of-the-art' methods, materials, and experimental techniques* Latest developments in tribomaterials, coatings, and lubricants providing superlubricity
Transport phenomena in plasmas are the relatively slow processes of particle momentum and energy transport systems in a state of mechanical equilibrium. In contrast to neutral gases, these phenomena in plasmas are greatly influenced by self-consistent fields, in particular electric fields. These can produce particle and energy fluxes, in addition to those generated by the inhomogeneity of the plasma composition and temperature. As a result, the physical effects accompanying transport phenomena in plasmas are far more numerous and complicated than those in neutral gases, and the solution of corresponding problems is more difficult. The effects, however, are usually far more interesting and sometimes surprising. This book presents a systematic survey and analysis of the main mechanisms of transport phenomena in plasma and gives examples of gradually increasing complexity to illustrate these mechanisms and the relationships between them. The author pays special attention to the analysis of experimental measurements and considers the relevant processes analytically as well as qualitatively. The majority of problems dealt with in this book are of considerable practical interest, and the phenomena described often determine the main characteristics of processes and devices. Transport Phenomena in Partially Ionized Plasma will be of interest to researchers who need to know the properties of real, specific systems, as well as to engineers and advanced students in the physics of plasmas, semiconductors, various types of gas discharges and the ionosphere.
