Mems/Nems
Mems/Nems

Author: Cornelius T. Leondes

Publisher: Springer Science & Business Media

Published: 2007-10-08

Total Pages: 2142

ISBN-13: 0387257861

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This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.

Microelectronics Packaging Handbook
Microelectronics Packaging Handbook

Author: R.R. Tummala

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 1060

ISBN-13: 1461560373

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Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Chip On Board
Chip On Board

Author: John H. Lau

Publisher: Springer Science & Business Media

Published: 1994-06-30

Total Pages: 584

ISBN-13: 9780442014414

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This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Neural Networks and Micromechanics
Neural Networks and Micromechanics

Author: Ernst Kussul

Publisher: Springer Science & Business Media

Published: 2009-12-01

Total Pages: 225

ISBN-13: 3642025358

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Micromechanical manufacturing based on microequipment creates new possibi- ties in goods production. If microequipment sizes are comparable to the sizes of the microdevices to be produced, it is possible to decrease the cost of production drastically. The main components of the production cost - material, energy, space consumption, equipment, and maintenance - decrease with the scaling down of equipment sizes. To obtain really inexpensive production, labor costs must be reduced to almost zero. For this purpose, fully automated microfactories will be developed. To create fully automated microfactories, we propose using arti?cial neural networks having different structures. The simplest perceptron-like neural network can be used at the lowest levels of microfactory control systems. Adaptive Critic Design, based on neural network models of the microfactory objects, can be used for manufacturing process optimization, while associative-projective neural n- works and networks like ART could be used for the highest levels of control systems. We have examined the performance of different neural networks in traditional image recognition tasks and in problems that appear in micromechanical manufacturing. We and our colleagues also have developed an approach to mic- equipment creation in the form of sequential generations. Each subsequent gene- tion must be of a smaller size than the previous ones and must be made by previous generations. Prototypes of ?rst-generation microequipment have been developed and assessed.

Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 9
Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 9

Author: Ram Ekwal Sah

Publisher: The Electrochemical Society

Published: 2007

Total Pages: 863

ISBN-13: 1566775523

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This issue of ECS Transactions contains the papers presented in the symposium on Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Emerging Dielectics held May 6-11, 2007 in Chicago. Papers were presented on deposition, characterization and applications of the dielectrics including high- and low-k dielectrics, as well as interface states, device characterization, reliabiliy and modeling.

Electronics Packaging Forum
Electronics Packaging Forum

Author: James E. Morris

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 459

ISBN-13: 9400904398

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Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

Electrically Conductive Adhesives
Electrically Conductive Adhesives

Author: Rajesh Gomatam

Publisher: CRC Press

Published: 2008-12-23

Total Pages: 436

ISBN-13: 9004187820

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With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni

Microwave Materials
Microwave Materials

Author: V.R.K. Murthy

Publisher: Springer Science & Business Media

Published: 2013-03-14

Total Pages: 263

ISBN-13: 3662087405

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Solid State Materials have been gaining importance in recent times especially in the context of devices which can provide necessary infrastructure and flexibility for various human endeavours. In this context, microwave materials have a unique place especially in various device applications as well as in communication networks. Various technological developments are taking place in fine-tuning these materials for specific applicatio"ns and in fixed band frequencies. Though the science and technology of these materials has reached an advanced stage, systematic attempts are still lacking in bringing all available information in a single source. The present. volume is a modest attempt in this direction, though it cannot be considered to be the one that satisfies completely desired components and information required. The editors have enlisted certain articles of interest in this area, especially those dealing with measurement techniques, chapters dealing with materials like Ferrites, YIGs, Radome and high Tc superconducting materials which are of current interest. The editors are fully aware that the coverages are not comprehensive either in scope or in depth. The purpose of this volume is only to acquaint oneself of certain aspects of a fast developing field. The editors will be grateful for any comments or suggestions in this endeavour. V. R. K. MURTHY S. SUNDARAM B. VISWANATHAN Contents Preface v 1. Materials and Processes in Microwave Integrated Circuits Fabrication 1 T. Rs. Reddy 2. Materials and Technology for Microwave Integrated Circuits 30 Bharathi Bhat and Shiban K. Koul 3.