Transputer Research and Applications 5
Transputer Research and Applications 5

Author: North American Transputer Users Group. Conference

Publisher: IOS Press

Published: 1992

Total Pages: 356

ISBN-13: 9789051990782

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Parallel processing is now becoming a household word among computer researchers and designers. This work contains 29 contributions from leading experts in the field attending the 1992 NATUG conference.

Compound Semiconductor Device Modelling
Compound Semiconductor Device Modelling

Author: Christopher M. Snowden

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 295

ISBN-13: 1447120485

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Compound semiconductor devices form the foundation of solid-state microwave and optoelectronic technologies used in many modern communication systems. In common with their low frequency counterparts, these devices are often represented using equivalent circuit models, but it is often necessary to resort to physical models in order to gain insight into the detailed operation of compound semiconductor devices. Many of the earliest physical models were indeed developed to understand the 'unusual' phenomena which occur at high frequencies. Such was the case with the Gunn and IMPATI diodes, which led to an increased interest in using numerical simulation methods. Contemporary devices often have feature sizes so small that they no longer operate within the familiar traditional framework, and hot electron or even quantum mechanical models are required. The need for accurate and efficient models suitable for computer aided design has increased with the demand for a wider range of integrated devices for operation at microwave, millimetre and optical frequencies. The apparent complexity of equivalent circuit and physics-based models distinguishes high frequency devices from their low frequency counterparts . . Over the past twenty years a wide range of modelling techniques have emerged suitable for describing the operation of compound semiconductor devices. This book brings together for the first time the most popular techniques in everyday use by engineers and scientists. The book specifically addresses the requirements and techniques suitable for modelling GaAs, InP. ternary and quaternary semiconductor devices found in modern technology.

Human-Computer Interaction Fundamentals
Human-Computer Interaction Fundamentals

Author: Andrew Sears

Publisher: CRC Press

Published: 2009-03-02

Total Pages: 352

ISBN-13: 1420088823

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Hailed on first publication as a compendium of foundational principles and cutting-edge research, The Human-Computer Interaction Handbook has become the gold standard reference in this field. Derived from select chapters of this groundbreaking and authoritative resource, Human-Computer Interaction Fundamentals emphasizes emerging topics such as sen

Technology Computer Aided Design for Si, SiGe and GaAs Integrated Circuits
Technology Computer Aided Design for Si, SiGe and GaAs Integrated Circuits

Author: G.A. Armstrong

Publisher: IET

Published: 2007-11-30

Total Pages: 457

ISBN-13: 0863417434

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The first book to deal with a broad spectrum of process and device design, and modeling issues related to semiconductor devices, bridging the gap between device modelling and process design using TCAD. Presents a comprehensive perspective of emerging fields and covers topics ranging from materials to fabrication, devices, modelling and applications. Aimed at research-and-development engineers and scientists involved in microelectronics technology and device design via Technology CAD, and TCAD engineers and developers.

Compound Semiconductor Integrated Circuits
Compound Semiconductor Integrated Circuits

Author: Tho T. Vu

Publisher: World Scientific

Published: 2003-01-01

Total Pages: 366

ISBN-13: 9789812796844

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This is the book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. The book also includes three papers focused on radiation effects and reliability in III-V semiconductor electronics, which are useful for reference and future directions. Moreover, reliability is covered in several papers separately for certain process technologies. Contents: Present and Future of High-Speed Compound Semiconductor IC''s (T Otsuji); The Transforming MMIC (E J Martinez); Distributed Amplifier for Fiber-Optic Communication Systems (H Shigematsu et al.); Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers (S Manohar et al.); Radiation Effects in High Speed III-V Integrated Circuits (T R Weatherford); Radiation Effects in III-V Semiconductor Electronics (B D Weaver et al.); Reliability and Radiation Hardness of Compound Semiconductors (S A Kayali & A H Johnston); and other papers. Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.