Encapsulation Technologies for Electronic Applications
Encapsulation Technologies for Electronic Applications

Author: Haleh Ardebili

Publisher: William Andrew

Published: 2018-10-23

Total Pages: 510

ISBN-13: 0128119799

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Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them

Printed Electronics
Printed Electronics

Author: Zheng Cui

Publisher: John Wiley & Sons

Published: 2016-09-26

Total Pages: 372

ISBN-13: 1118920929

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This book provides an overview of the newly emerged and highly interdisciplinary field of printed electronics • Provides an overview of the latest developments and research results in the field of printed electronics • Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics • Discusses the principles of the above topics, with support of examples and graphic illustrations • Serves both as an advanced introductory to the topic and as an aid for professional development into the new field • Includes end of chapter references and links to further reading

Polymers for Electronic & Photonic Application
Polymers for Electronic & Photonic Application

Author: C. P. Wong

Publisher: Elsevier

Published: 2013-10-22

Total Pages: 676

ISBN-13: 1483289397

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The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field.* Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field

Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies
Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies

Author: Kenichi Takahata

Publisher: BoD – Books on Demand

Published: 2013-05-29

Total Pages: 238

ISBN-13: 9535110853

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MEMS technology is increasingly penetrating into our lives and improving our quality of life. In parallel to this, advances in nanotechnology and nanomaterials have been catalyzing the rise of NEMS. Consisting of nine chapters reviewing state-of-the-art technologies and their future trends, this book focuses on the latest development of devices and fabrication processes in the field of these extremely miniaturized electromechanical systems. The book offers new knowledge and insight into design, fabrication, and packaging, as well as solutions in these aspects for targeted applications, aiming to support scientists, engineers and academic trainees who are engaged in relevant research. In the chapters, practical issues and advances are discussed for flexible microdevices, bioMEMS, intelligent implants, optical MEMS, nanomachined structures and NEMS, and others. Most of the chapters also focus on novel fabrication/packaging processes, including silicon bulk micromachining, laser micromachining, nanolithography, and packaging for implantable microelectronics enabled by nanomaterials.

Spray Drying Techniques for Food Ingredient Encapsulation
Spray Drying Techniques for Food Ingredient Encapsulation

Author: C. Anandharamakrishnan

Publisher: John Wiley & Sons

Published: 2015-07-23

Total Pages: 315

ISBN-13: 1118864271

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Spray drying is a well-established method for transforming liquid materials into dry powder form. Widely used in the food and pharmaceutical industries, this technology produces high quality powders with low moisture content, resulting in a wide range of shelf stable food and other biologically significant products. Encapsulation technology for bioactive compounds has gained momentum in the last few decades and a series of valuable food compounds, namely flavours, carotenoids and microbial cells have been successfully encapsulated using spray drying. Spray Drying Technique for Food Ingredient Encapsulation provides an insight into the engineering aspects of the spray drying process in relation to the encapsulation of food ingredients, choice of wall materials, and an overview of the various food ingredients encapsulated using spray drying. The book also throws light upon the recent advancements in the field of encapsulation by spray drying, i.e., nanospray dryers for production of nanocapsules and computational fluid dynamics (CFD) modeling. Addressing the basics of the technology and its applications, the book will be a reference for scientists, engineers and product developers in the industry.

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

Author: Rao Tummala

Publisher: McGraw Hill Professional

Published: 2019-11-20

Total Pages: 849

ISBN-13: 1259861562

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A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field

Nitride Semiconductor Light-Emitting Diodes (LEDs)
Nitride Semiconductor Light-Emitting Diodes (LEDs)

Author: Jian-Jang Huang

Publisher: Woodhead Publishing

Published: 2014-02-14

Total Pages: 673

ISBN-13: 0857099302

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The development of nitride-based light-emitting diodes (LEDs) has led to advancements in high-brightness LED technology for solid-state lighting, handheld electronics, and advanced bioengineering applications. Nitride Semiconductor Light-Emitting Diodes (LEDs) reviews the fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations. Part one reviews the fabrication of nitride semiconductor LEDs. Chapters cover molecular beam epitaxy (MBE) growth of nitride semiconductors, modern metalorganic chemical vapor deposition (MOCVD) techniques and the growth of nitride-based materials, and gallium nitride (GaN)-on-sapphire and GaN-on-silicon technologies for LEDs. Nanostructured, non-polar and semi-polar nitride-based LEDs, as well as phosphor-coated nitride LEDs, are also discussed. Part two covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots. Further chapters discuss the development of LED encapsulation technology and the fundamental efficiency droop issues in gallium indium nitride (GaInN) LEDs. Finally, part three highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infrared emitters, and automotive lighting. Nitride Semiconductor Light-Emitting Diodes (LEDs) is a technical resource for academics, physicists, materials scientists, electrical engineers, and those working in the lighting, consumer electronics, automotive, aviation, and communications sectors. - Reviews fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations - Covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots - Highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infra-red emitters, and automotive lighting

Lead-free Soldering Process Development and Reliability
Lead-free Soldering Process Development and Reliability

Author: Jasbir Bath

Publisher: John Wiley & Sons

Published: 2020-06-12

Total Pages: 512

ISBN-13: 1119482046

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Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.