Materials for Electronic Packaging
Materials for Electronic Packaging

Author: Deborah D.L. Chung

Publisher: Elsevier

Published: 1995-03-31

Total Pages: 383

ISBN-13: 0080511171

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Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. - Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors - Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science - Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems

Multichip Module Technologies and Alternatives: The Basics
Multichip Module Technologies and Alternatives: The Basics

Author: Daryl Ann Doane

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 895

ISBN-13: 1461531004

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Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

The Science and Technology of Flexible Packaging
The Science and Technology of Flexible Packaging

Author: Barry A. Morris

Publisher: William Andrew

Published: 2022-07-23

Total Pages: 846

ISBN-13: 0323855741

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The Science and Technology of Flexible Packaging: Multilayer Films from Resin and Process to End Use, Second Edition provides a comprehensive guide on plastic films in flexible packaging, covering scientific principles, materials properties, processes and end use considerations. Sections discuss the science of multilayer films in a concise and impactful way, presenting the fundamental understanding required to improve product design, material selection and processes. In addition, the book includes information on why one material is favored over another and how film or coating affects material properties. Descriptions and analysis of key properties of packaging films are provided from engineering and scientific perspectives. With essential scientific insights, best practice techniques, environmental sustainability information and key principles of structure design, this book provides information aids in material selection and processing, how to shorten development times and deliver stronger products, and ways to enable engineers and scientists to deliver superior products with reduced development time and cost. - Provides essential information on all aspects of multilayer films in flexible packaging, including processing, properties, materials and end use - Bridges the gap between scientific principles and practical challenges - Includes explanations to assist practitioners in overcoming challenges - Enables the reader to address new challenges, such as design for sustainability and eCommerce

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Author: Ephraim Suhir

Publisher: CRC Press

Published: 2021-01-28

Total Pages: 344

ISBN-13: 0429863829

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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.

Amorphous and Crystalline Silicon Carbide IV
Amorphous and Crystalline Silicon Carbide IV

Author: Cary Y. Yang

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 439

ISBN-13: 3642848044

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Silicon carbide and other group IV-IV materials in their amorphous, microcrystalline, and crystalline forms have a wide variety of applications.The contributions to this volume report recent developments and trends in the field. The purpose is to make available the current state of understanding of the materials and their potential applications. Eachcontribution focuses on a particular topic, such as preparation methods, characterization, and models explaining experimental findings. The volume also contains the latest results in the exciting field of SiGe/Si heterojunction bipolar transistors. The reader will find this book valuable as a reference source, an up-to-date and in-depth overview of this field, and, most importantly, as a window into the immense range of reading potential applications of silicon carbide. It is essential for scientists, engineers and students interested in electronic materials, high-speed heterojunction devices, and high-temperature optoelectronics.