Electronic Packaging Science and Technology
Electronic Packaging Science and Technology

Author: King-Ning Tu

Publisher: John Wiley & Sons

Published: 2021-12-29

Total Pages: 340

ISBN-13: 1119418313

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Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging

Author: Xingcun Colin Tong

Publisher: Springer Science & Business Media

Published: 2011-01-05

Total Pages: 633

ISBN-13: 1441977597

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Author: Hengyun Zhang

Publisher: Woodhead Publishing

Published: 2019-11-14

Total Pages: 436

ISBN-13: 0081025335

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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging

Materials for Advanced Packaging
Materials for Advanced Packaging

Author: Daniel Lu

Publisher: Springer

Published: 2016-11-18

Total Pages: 974

ISBN-13: 3319450980

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Essentials of Electronic Packaging
Essentials of Electronic Packaging

Author: Puligandla Viswanadham

Publisher: American Society of Mechanical Engineers

Published: 2011

Total Pages: 0

ISBN-13: 9780791859667

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ASME Press Book Series on Electronic Packaging. Series Editor: Dereje Agonafer. This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates, b) various types of components and packages, c) materials and processes, d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.

Electronic Packaging Materials and Their Properties
Electronic Packaging Materials and Their Properties

Author: Michael Pecht

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 120

ISBN-13: 1498730868

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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Power Electronic Packaging
Power Electronic Packaging

Author: Yong Liu

Publisher: Springer Science & Business Media

Published: 2012-02-15

Total Pages: 606

ISBN-13: 1461410533

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

The Science and Technology of Flexible Packaging
The Science and Technology of Flexible Packaging

Author: Barry A. Morris

Publisher: William Andrew

Published: 2022-07-23

Total Pages: 846

ISBN-13: 0323855741

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The Science and Technology of Flexible Packaging: Multilayer Films from Resin and Process to End Use, Second Edition provides a comprehensive guide on plastic films in flexible packaging, covering scientific principles, materials properties, processes and end use considerations. Sections discuss the science of multilayer films in a concise and impactful way, presenting the fundamental understanding required to improve product design, material selection and processes. In addition, the book includes information on why one material is favored over another and how film or coating affects material properties. Descriptions and analysis of key properties of packaging films are provided from engineering and scientific perspectives. With essential scientific insights, best practice techniques, environmental sustainability information and key principles of structure design, this book provides information aids in material selection and processing, how to shorten development times and deliver stronger products, and ways to enable engineers and scientists to deliver superior products with reduced development time and cost. - Provides essential information on all aspects of multilayer films in flexible packaging, including processing, properties, materials and end use - Bridges the gap between scientific principles and practical challenges - Includes explanations to assist practitioners in overcoming challenges - Enables the reader to address new challenges, such as design for sustainability and eCommerce

Electronic Packaging
Electronic Packaging

Author: John H. Lau

Publisher: McGraw-Hill Professional Publishing

Published: 1998

Total Pages: 0

ISBN-13: 9780070371354

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Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.