Development of Criteria for the Selection of Terminal Equipment in an Interconnect Environment
Author: C. L. Sheng
Publisher:
Published: 1981
Total Pages: 156
ISBN-13:
DOWNLOAD EBOOKRead and Download eBook Full
Author: C. L. Sheng
Publisher:
Published: 1981
Total Pages: 156
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 1982
Total Pages: 200
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 1980
Total Pages: 148
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 2004
Total Pages: 576
ISBN-13:
DOWNLOAD EBOOKAuthor: Transit Development Corporation
Publisher:
Published: 1976
Total Pages: 424
ISBN-13:
DOWNLOAD EBOOKAuthor: Transit Development Corporation
Publisher:
Published: 1975
Total Pages: 420
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 2004
Total Pages: 646
ISBN-13:
DOWNLOAD EBOOKAuthor:
Publisher:
Published: 1985
Total Pages: 460
ISBN-13:
DOWNLOAD EBOOKAuthor: Kamisetty Rao
Publisher: John Wiley & Sons
Published: 2006-01-10
Total Pages: 773
ISBN-13: 0471656402
DOWNLOAD EBOOKA comprehensive resource on multimedia communications. Covers recent trends and standardization activities in multimedia communications, such as layered structures, underlying theories and the current best design techniques. Describes the convergence of various technologies including communications, broadcasting, information technology, and home electronics, and emerging new communication services and applications resulting from the growth of the Internet and wireless technologies. Please go to www-ee.uta.edu/dip for additional information.
Author: Yosi Shacham-Diamand
Publisher: Springer Science & Business Media
Published: 2009-09-19
Total Pages: 545
ISBN-13: 0387958681
DOWNLOAD EBOOKIn Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.