Cleaning Technology in Semiconductor Device Manufacturing
Author:
Publisher: The Electrochemical Society
Published: 2000
Total Pages: 636
ISBN-13: 9781566772594
DOWNLOAD EBOOKRead and Download eBook Full
Author:
Publisher: The Electrochemical Society
Published: 2000
Total Pages: 636
ISBN-13: 9781566772594
DOWNLOAD EBOOKAuthor: Jerzy Rużyłło
Publisher: The Electrochemical Society
Published: 2004
Total Pages: 452
ISBN-13: 9781566774116
DOWNLOAD EBOOKAuthor: Takeshi Hattori
Publisher: Springer Science & Business Media
Published: 2013-03-09
Total Pages: 634
ISBN-13: 3662035359
DOWNLOAD EBOOKA totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.
Author:
Publisher:
Published: 2002
Total Pages: 392
ISBN-13:
DOWNLOAD EBOOKAuthor: Richard E. Novak
Publisher: The Electrochemical Society
Published: 1996
Total Pages: 642
ISBN-13: 9781566771153
DOWNLOAD EBOOKAuthor: Takeshi Hattori
Publisher: The Electrochemical Society
Published: 2009-09
Total Pages: 407
ISBN-13: 1566777429
DOWNLOAD EBOOKThis issue of ECS Transactions includes papers presented during the 11th International Symposium on Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing held during the ECS Fall Meeting in Vienna, Austria, October 4-9, 2009.
Author: Monika Freunek Muller
Publisher: John Wiley & Sons
Published: 2021-08-16
Total Pages: 154
ISBN-13: 1119242010
DOWNLOAD EBOOKPHOTOVOLTAIC MANUFACTURING This book covers the state-of-the-art and the fundamentals of silicon wafer solar cells manufacturing, written by world-class researchers and experts in the field. High quality and economic photovoltaic manufacturing is central to realizing reliable photovoltaic power supplies at reasonable cost. While photovoltaic silicon wafer manufacturing is at a mature, industrial and mass production stage, knowing and applying the fundamentals in solar manufacturing is essential to anyone working in this field. This is the first book on photovoltaic wet processing for silicon wafers, both mono- and multi-crystalline. The comprehensive book provides information for process, equipment, and device engineers and researchers in the solar manufacturing field. The authors of the chapters are world-class researchers and experts in their field of endeavor. The fundamentals of wet processing chemistry are introduced, covering etching, texturing, cleaning and metrology. New developments, innovative approaches, as well as current challenges are presented. Benefits of reading the book include: The book includes a detailed discussion of the important new development of black silicon, which is considered to have started a new wave in photovoltaics and become the new standard while substantially lowering the cost. Photovoltaics are central to any country’s “New Green Deal” and this book shows how to manufacture competitively. The book’s central goal is to show photovoltaic manufacturing can be done with enhanced quality and lowering costs. Audience Engineers, chemists, physicists, process technologists, in both academia and industry, that work with photovoltaics and their manufacture.
Author: Jerzy Rużyłło
Publisher: The Electrochemical Society
Published: 1998
Total Pages: 668
ISBN-13: 9781566771887
DOWNLOAD EBOOKAuthor: Takeshi Hattori
Publisher: The Electrochemical Society
Published: 2007
Total Pages: 497
ISBN-13: 156677568X
DOWNLOAD EBOOKThis issue covers topics related to the removal of contaminants from and conditioning of Si (SOI), SiC, Ge, SiGe, and III-V semiconductor surfaces; cleaning media, including non-aqueous cleaning methods and tools; front- and back-end cleaning operations; integrated cleaning; cleaning of MEMS; photomasks (reticles); porous low-k dielectrics; post-CMP cleaning; wafer bevel cleaning and polishing; characterization, evaluation, and monitoring of cleaning; correlation with device performance as well as cleaning of equipment and storage and handling hardware. The hardcover edition includes a bonus CD-ROM of Cleaning Technology in Semiconductor Device Manufacturing 1989?2007: Proceedings from the ECS Semiconductor Cleaning Symposia 1?10. This bonus material is not available with the PDF edition.
Author: Toshiro Doi
Publisher: William Andrew
Published: 2011-12-06
Total Pages: 330
ISBN-13: 1437778593
DOWNLOAD EBOOKCMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan