This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units. The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management.
The subject of this book is CMOS RF circuit design for reliability. The device reliability and process variation issues on RF transmitter and receiver circuits will be particular interest to the readers in the field of semiconductor devices and circuits. This proposed book is unique to explore typical reliability issues in the device and technology level and then to examine their impact on RF wireless transceiver circuit performance. Analytical equations, experimental data, device and circuit simulation results will be given for clear explanation. The main benefit the reader derive from this book will be clear understanding on how device reliability issues affects the RF circuit performance subjected to operation aging and process variations.
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
As the complexity and the density of VLSI chips increase with shrinking design rules, the evaluation of long-term reliability of MOS VLSI circuits is becoming an important problem. The assessment and improvement of reliability on the circuit level should be based on both the failure mode analysis and the basic understanding of the physical failure mechanisms observed in integrated circuits. Hot-carrier induced degrada tion of MOS transistor characteristics is one of the primary mechanisms affecting the long-term reliability of MOS VLSI circuits. It is likely to become even more important in future generation chips, since the down ward scaling of transistor dimensions without proportional scaling of the operating voltage aggravates this problem. A thorough understanding of the physical mechanisms leading to hot-carrier related degradation of MOS transistors is a prerequisite for accurate circuit reliability evaluation. It is also being recognized that important reliability concerns other than the post-manufacture reliability qualification need to be addressed rigorously early in the design phase. The development and use of accurate reliability simulation tools are therefore crucial for early assessment and improvement of circuit reliability : Once the long-term reliability of the circuit is estimated through simulation, the results can be compared with predetermined reliability specifications or limits. If the predicted reliability does not satisfy the requirements, appropriate design modifications may be carried out to improve the resistance of the devices to degradation.
This book focuses on modeling, simulation and analysis of analog circuit aging. First, all important nanometer CMOS physical effects resulting in circuit unreliability are reviewed. Then, transistor aging compact models for circuit simulation are discussed and several methods for efficient circuit reliability simulation are explained and compared. Ultimately, the impact of transistor aging on analog circuits is studied. Aging-resilient and aging-immune circuits are identified and the impact of technology scaling is discussed. The models and simulation techniques described in the book are intended as an aid for device engineers, circuit designers and the EDA community to understand and to mitigate the impact of aging effects on nanometer CMOS ICs.
This book is intended for readers who are interested in the design of robust and reliable electronic digital systems. The authors cover emerging trends in design of today’s reliable electronic systems which are applicable to safety-critical applications, such as automotive or healthcare electronic systems. The emphasis is on modeling approaches and algorithms for analysis and mitigation of soft errors in nano-scale CMOS digital circuits, using techniques that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. The authors introduce software tools for analysis and mitigation of soft errors in electronic systems, which can be integrated easily with design flows. In addition to discussing soft error aware analysis techniques for combinational logic, the authors also describe new soft error mitigation strategies targeting commercial digital circuits. Coverage includes novel Soft Error Rate (SER) analysis techniques such as process variation aware SER estimation and GPU accelerated SER analysis techniques, in addition to SER reduction methods such as gate sizing and logic restructuring based SER techniques.
The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function. This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are followed by discussions of the principles of other design components, including linear integrated circuits, digital circuits, and power supplies. The remaining chapters consider the vital role of electromagnetic compatibility in circuit design. These chapters also look into safety, design of production, testability, reliability, and thermal management of the designed circuit. This book is of great value to electrical and design engineers.
The book charts how reliability engineering has moved from the use of sometimes arbitrary standards to an empirical scientific approach of understanding operating conditions, failure mechanisms, the need for testing for a more realistic characterisation and, new for the second edition, includes the monitoring of performance/robustness in the field. Reliability Characterisation of Electrical and Electronic Systems brings together a number of experts and key players in the discipline to concisely present the fundamentals and background to reliability theory, elaborate on the current thinking and developments behind reliability characterisation, and give a detailed account of emerging issues across a wide range of applications. The second edition has a new section titled Reliability Condition Monitoring and Prognostics for Specific Application which provides a guide to critical issues in key industrial sectors such as automotive and aerospace. There are also new chapters on areas of growing importance such as reliability methods in high-temperature electronics and reliability and testing of electric aircraft power systems. Reviews emerging areas of importance such as reliability methods in high-temperature electronics and reliability testing of electric vehicles Looks at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability Facilitates a greater understanding of operating conditions, failure mechanisms and the need for testing
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
This book addresses the needs of electronic design engineers, reliability engineers, and their respective managers, stressing a pragmatic viewpoint rather than a vigorous mathematical presentation.
