Metal-Ceramic Interfaces
Metal-Ceramic Interfaces

Author: M. Rühle

Publisher: Elsevier

Published: 2013-10-22

Total Pages: 448

ISBN-13: 1483287467

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As engineering materials and structures often contain a metal or metallic alloy bonded to a ceramic, the resultant interface must be able to sustain mechanical forces without failure. They also play an important role in oxidation or reduction of materials. The workshop on 'Bonding, Structure and Mechanical Properties of Metal/Ceramic Interfaces' was held in January 1989 within the Acta/Scripta Metallurgica conference series. It drew together an international collection of 70 scientists who discussed a wide range of issues related to metal-ceramic interfaces. The sessions were divided into 7 categories: structure and bonding, chemistry at interfaces, formation of interfaces, structure of interfaces, thermodynamics/atomistics of interface fracture, mechanics of interface cracks, and fracture resistance of bimaterial interfaces. Within these headings attention was paid to grain boundaries, the influence of chemical processes on the behaviour of interfaces, diffusion bonding, characterization of fracture, and crack propagation by fatigue and by stress corrosion. The book presents a useful reference source for materials scientists, physicists, chemists, and mechanical engineers who are concerned with the roles and properties of interfaces.

Joining of Titanium
Joining of Titanium

Author: Robert Edward Monroe

Publisher:

Published: 1967

Total Pages: 86

ISBN-13:

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This report supplies information on joining processes applicable to titanium and its alloys in sheet metal applications, primarily related directly to airframe construction. Although the material presented here does not cover all titanium joining processes, and omits such processes as plasma-arc, submerged-arc, electroslag, flash, and high-frequency resistance welding, the data presented cover materials up to 2-inches thick in some cases and the report should be useful to anyone seeking titanium joining information. The joining processes covered fall into five categories: welding, brazing, metallurgical bonding (diffusion and deformation bonding), adhesive bonding, and mechanical fastening. The fusion welding processes that are discussed in detail include gas tungsten arc, gas metal arc, arc spot, and electron beam. The resistance processes give extended coverage are spot, roll spot, and seam welding. (Author).

Chemically Bonded Phosphate Ceramics
Chemically Bonded Phosphate Ceramics

Author: Arun S. Wagh

Publisher: Elsevier

Published: 2016-05-17

Total Pages: 424

ISBN-13: 008100396X

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Chemically Bonded Phosphate Ceramics brings together the latest developments in chemically bonded phosphate ceramics (CBPCs), including several novel ceramics, from US Federal Laboratories such as Argonne, Oak Ridge, and Brookhaven National Laboratories, as well as Russian and Ukrainian nuclear institutes. Coupled with further advances in their use as biomaterials, these materials have found uses in diverse fields in recent years. Applications range from advanced structural materials to corrosion and fire protection coatings, oil-well cements, stabilization and encapsulation of hazardous and radioactive waste, nuclear radiation shielding materials, and products designed for safe storage of nuclear materials. Such developments call for a single source to cover their science and applications. This book is a unique and comprehensive source to fulfil that need. In the second edition, the author covers the latest developments in nuclear waste containment and introduces new products and applications in areas such as biomedical implants, cements and coatings used in oil-well and other petrochemical applications, and flame-retardant anti-corrosion coatings. - Explores the key applications of CBPCs including nuclear waste storage, oil-well cements, anticorrosion coatings and biomedical implants - Demystifies the chemistry, processes and production methods of CBPCs - Draws on 40 years of developments and applications in the field, including the latest developments from USA, Europe, Ukraine, Russia, China and India

3D and Circuit Integration of MEMS
3D and Circuit Integration of MEMS

Author: Masayoshi Esashi

Publisher: John Wiley & Sons

Published: 2021-03-16

Total Pages: 528

ISBN-13: 3527823255

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Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Wettability at High Temperatures
Wettability at High Temperatures

Author: N. Eustathopoulos

Publisher: Elsevier

Published: 1999-11-24

Total Pages: 439

ISBN-13: 0080543782

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The purpose of this book is to bring together current scientific understanding of wetting behaviour that has been gained from theoretical models and quantitative experimental observations. The materials considered are liquid metals or inorganic glasses in contact with solid metals or ceramics at temperatures of 200-2000oC. Wetting has been a significant scientific concern for the last two centuries and reference will be made to classical work by nineteenth century scientists such as Dupré, Laplace and Young that was validated by observations of the behaviour of chemically inert ambient temperature systems.In attempting to achieve the aims of the book, the text has been divided into ten Chapters that can be grouped into four stages of presentation. The first stage comprises two Chapters that review established and newly developed models for their relevance to wetting behaviour at high temperatures, including recent models that encompass the role of chemical reactions at the solid/liquid interfaces. Attention is paid both to equilibrium wetting behaviour (Chapter 1) and to the factors that control the approach to equilibrium (Chapter 2). Then follow Chapters concerned with experimental techniques for scientific measurement of the extent of wetting (Chapter 3) and with the surface energy data for both metals and non-metals that are essential for quantitative interpretation of wetting behaviour (Chapter 4). Descriptions of experimentally determined and quantified wetting behaviour are presented and interpreted in the third part comprising five Chapters dealing with the characteristics of metal/metal, metal/oxide, metal/non-oxide, metal/carbon and molten glass/solid systems. The book concludes with a Chapter commenting on the role of wetting behaviour in joining similar and dissimilar materials by liquid route techniques.

The Cold Spray Materials Deposition Process
The Cold Spray Materials Deposition Process

Author:

Publisher: Elsevier

Published: 2007-09-21

Total Pages: 377

ISBN-13: 1845693787

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The cold spray process produces dense, low oxide coatings which can be used in such diverse applications as corrosion control and metals repair. It has emerged as an important alternative to thermal spray coating techniques in certain areas. This pioneering book reviews both the fundamentals of the process and how it can best be applied in practice. The first part of the book discusses the development of the process together with its advantages and disadvantages in comparison with thermal spray coating techniques. Part two reviews key process parameters such as powders, nozzle design, particle temperature and velocity, and particle/substrate interaction. It also describes portable and stationary cold spray systems. The final part of the book discusses how the cold spray process can be applied in such areas as improved wear, corrosion protection, electromagnetic interference shielding and repair of damaged components. The cold spray materials deposition process is a standard reference on this important process and its industrial applications. Examines the fundamentals of the cold spraying process Assesses how the technique can best be applied in practice Describes portable and stationary cold spray systems

Microelectronics Packaging Handbook
Microelectronics Packaging Handbook

Author: R.R. Tummala

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 742

ISBN-13: 1461540860

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Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Joining of Ceramics
Joining of Ceramics

Author: M.G. Nicholas

Publisher: Springer

Published: 1990

Total Pages: 240

ISBN-13:

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An examination of the methods used and the types of bonding that occur in the joining of ceramics to glass or metals, both on surfaces and at joints. The book deals with both the physical and chemical aspects of the bonding.

Joining Technologies
Joining Technologies

Author: Mahadzir Ishak

Publisher: BoD – Books on Demand

Published: 2016-09-21

Total Pages: 286

ISBN-13: 9535125966

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Joining and welding are two of the most important processes in manufacturing. These technologies have vastly improved and are now extensively used in numerous industries. This book covers a wide range of topics, from arc welding (GMAW and GTAW), FSW, laser and hybrid welding, and magnetic pulse welding on metal joining to the application of joining technologies for textile products. The analysis of temperature and phase transformation is also incorporated. This book also discusses the issue of dissimilar joint between metal and ceramic, as well as the technology of diffusion bonding.