Advanced Gate Stack Materials and Processes for Sub-100 Nm CMOS Applcations
Author: Qiang Lu
Publisher:
Published: 2002
Total Pages: 320
ISBN-13:
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Author: Qiang Lu
Publisher:
Published: 2002
Total Pages: 320
ISBN-13:
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Publisher:
Published: 2005
Total Pages: 658
ISBN-13:
DOWNLOAD EBOOKAuthor: Fred Roozeboom
Publisher: The Electrochemical Society
Published: 2006
Total Pages: 472
ISBN-13: 1566775027
DOWNLOAD EBOOKThese proceedings describe processing, materials, and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Author: Pushkar Sharad Ranade
Publisher:
Published: 2002
Total Pages: 276
ISBN-13:
DOWNLOAD EBOOKAuthor: P. J. Timans
Publisher: The Electrochemical Society
Published: 2008-05
Total Pages: 488
ISBN-13: 1566776260
DOWNLOAD EBOOKThis issue describes processing, materials and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Author: V. Narayanan
Publisher: The Electrochemical Society
Published: 2009-05
Total Pages: 367
ISBN-13: 1566777097
DOWNLOAD EBOOKThis issue of ¿ECS Transactions¿ describes processing, materials and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics include strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Author: E. P. Gusev
Publisher: The Electrochemical Society
Published: 2010-04
Total Pages: 426
ISBN-13: 1566777917
DOWNLOAD EBOOKThese proceedings describe processing, materials and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Author: F. Roozeboom
Publisher: The Electrochemical Society
Published: 2017
Total Pages: 279
ISBN-13: 1607688085
DOWNLOAD EBOOKAuthor: David Harame
Publisher: The Electrochemical Society
Published: 2008
Total Pages: 1136
ISBN-13: 1566776562
DOWNLOAD EBOOKAdvanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds have become a key component of the arsenal in improving semiconductor performance. This issue of ECS Transactions discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
Author: Michael S Shur
Publisher: World Scientific
Published: 2006-08-10
Total Pages: 774
ISBN-13: 9814477478
DOWNLOAD EBOOKFrontiers in Electronics reports on the most recent developments and future trends in the electronics and photonics industry. The issues address CMOS, SOI and wide band gap semiconductor technology, terahertz technology, and bioelectronics, providing a unique interdisciplinary overview of the key emerging issues.This volume accurately reflects the recent research and development trends: from pure research to research and development; and its contributors are leading experts in microelectronics, nanoelectronics, and nanophotonics from academia, industry, and government agencies.