3D IC Stacking Technology
3D IC Stacking Technology

Author: Banqiu Wu

Publisher: McGraw Hill Professional

Published: 2011-10-14

Total Pages: 543

ISBN-13: 0071741968

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The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology

Three Dimensional System Integration
Three Dimensional System Integration

Author: Antonis Papanikolaou

Publisher: Springer Science & Business Media

Published: 2010-12-07

Total Pages: 251

ISBN-13: 1441909621

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology

Author: Chuan Seng Tan

Publisher: Springer Science & Business Media

Published: 2009-06-29

Total Pages: 365

ISBN-13: 0387765344

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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Handbook of 3D Integration, Volume 4
Handbook of 3D Integration, Volume 4

Author: Paul D. Franzon

Publisher: John Wiley & Sons

Published: 2019-01-25

Total Pages: 655

ISBN-13: 3527697063

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This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

3D IC Integration and Packaging
3D IC Integration and Packaging

Author: John H. Lau

Publisher: McGraw Hill Professional

Published: 2015-07-06

Total Pages: 481

ISBN-13: 007184807X

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A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.3D IC Integration and Packaging covers:• 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP

3D Integration in VLSI Circuits
3D Integration in VLSI Circuits

Author: Katsuyuki Sakuma

Publisher: CRC Press

Published: 2018-04-17

Total Pages: 211

ISBN-13: 1351779826

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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Author: Brandon Noia

Publisher: Springer Science & Business Media

Published: 2013-11-19

Total Pages: 260

ISBN-13: 3319023780

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This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

3D IC Devices, Technologies, and Manufacturing
3D IC Devices, Technologies, and Manufacturing

Author: Hong Xiao

Publisher: Spie Society of Photo-Optical Instrumentation Engineers (Spie

Published: 2016-04

Total Pages: 220

ISBN-13: 9781510601468

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This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging.

Wireless Interface Technologies for 3D IC and Module Integration
Wireless Interface Technologies for 3D IC and Module Integration

Author: Tadahiro Kuroda

Publisher: Cambridge University Press

Published: 2021-09-30

Total Pages: 337

ISBN-13: 110884121X

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Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces

Author: Beth Keser

Publisher: John Wiley & Sons

Published: 2021-12-29

Total Pages: 324

ISBN-13: 1119793777

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Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.