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Author: Xingsheng Liu
Publisher: Springer
Published: 2014-07-14
Total Pages: 415
ISBN-13: 1461492637
DOWNLOAD EBOOKThis book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Author: James E. Morris
Publisher: Springer
Published: 2018-09-22
Total Pages: 1007
ISBN-13: 3319903624
DOWNLOAD EBOOKThis book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author: Sanjay Yadav
Publisher: Springer Nature
Published: 2020-06-01
Total Pages: 799
ISBN-13: 9811526478
DOWNLOAD EBOOKThis book presents selected peer-reviewed papers from the International Conference on Mechanical and Energy Technologies, which was held on 7–8 November 2019 at Galgotias College of Engineering and Technology, Greater Noida, India. The book reports on the latest developments in the field of mechanical and energy technology in contributions prepared by experts from academia and industry. The broad range of topics covered includes aerodynamics and fluid mechanics, artificial intelligence, nonmaterial and nonmanufacturing technologies, rapid manufacturing technologies and prototyping, remanufacturing, renewable energies technologies, metrology and computer-aided inspection, etc. Accordingly, the book offers a valuable resource for researchers in various fields, especially mechanical and industrial engineering, and energy technologies.
Author: Vinit Kumar Gunjan
Publisher: Springer Nature
Published: 2020-10-17
Total Pages: 998
ISBN-13: 9811572348
DOWNLOAD EBOOKThis book gathers selected research papers presented at the International Conference on Recent Trends in Machine Learning, IOT, Smart Cities & Applications (ICMISC 2020), held on 29–30 March 2020 at CMR Institute of Technology, Hyderabad, Telangana, India. Discussing current trends in machine learning, Internet of things, and smart cities applications, with a focus on multi-disciplinary research in the area of artificial intelligence and cyber-physical systems, this book is a valuable resource for scientists, research scholars and PG students wanting formulate their research ideas and find the future directions in these areas. Further, it serves as a reference work anyone wishing to understand the latest technologies used by practicing engineers around the globe.
Author: Yingmin Jia
Publisher: Springer
Published: 2015-12-11
Total Pages: 454
ISBN-13: 3662483653
DOWNLOAD EBOOKThis book presents selected research papers from the 2015 Chinese Intelligent Systems Conference (CISC’15), held in Yangzhou, China. The topics covered include multi-agent systems, evolutionary computation, artificial intelligence, complex systems, computation intelligence and soft computing, intelligent control, advanced control technology, robotics and applications, intelligent information processing, iterative learning control, and machine learning. Engineers and researchers from academia, industry and the government can gain valuable insights into solutions combining ideas from multiple disciplines in the field of intelligent systems.
Author: John D. Cressler
Publisher: CRC Press
Published: 2017-12-19
Total Pages: 1044
ISBN-13: 1351832808
DOWNLOAD EBOOKUnfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Author: Cher Ming Tan
Publisher: Woodhead Publishing
Published: 2022-09-24
Total Pages: 190
ISBN-13: 012822407X
DOWNLOAD EBOOKReliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. - Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them - Describes the chemistry underlying the material degradation and its impact on LEDs - Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Author: Yan Li
Publisher: Springer Nature
Published: 2020-11-23
Total Pages: 629
ISBN-13: 9811570906
DOWNLOAD EBOOKThis book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Author: S. W. Ricky Lee
Publisher: John Wiley & Sons
Published: 2021-09-17
Total Pages: 256
ISBN-13: 1118881559
DOWNLOAD EBOOKFROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
Author: Avram Bar-Cohen
Publisher: World Scientific
Published: 2019
Total Pages: 1079
ISBN-13: 9811209634
DOWNLOAD EBOOK"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website
