Rapid Thermal and Integrated Processing II:
Rapid Thermal and Integrated Processing II:

Author: Jeffrey C. Gelpey

Publisher: Cambridge University Press

Published: 2014-06-05

Total Pages: 444

ISBN-13: 9781107409491

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Rapid Thermal and Integrated Processing V: Volume 429
Rapid Thermal and Integrated Processing V: Volume 429

Author: J. C. Gelpey

Publisher:

Published: 1996-10-14

Total Pages: 416

ISBN-13:

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This book is the latest in a continuing series on rapid thermal processing and related topics. It embraces a diversity of research, development and manufacturing activities that require rapid thermal and integrated processing techniques which are recognized by their acronyms, such as rapid thermal annealing (RTA), rapid thermal processing (RTP), rapid thermal chemical vapor deposition (RTCVP), rapid thermal oxidation (RTO), and others. This fifth anniversary volume reports notable advances in the use of rapid thermal techniques in processing science and technology, and for process control in industrial fabrication facilities. It is organized around progress obtained through: evaluation methodology; equipment and process modelling; temperature control; defects and diffusion associated with annealing; metallizations such as silicidation; novel processing of sol-gel and magnetic films; dielectric growth and deposition; and silicon or silicon-germanium film deposition.

Advances in Rapid Thermal and Integrated Processing
Advances in Rapid Thermal and Integrated Processing

Author: F. Roozeboom

Publisher: Springer Science & Business Media

Published: 1996-03-31

Total Pages: 592

ISBN-13: 9780792340119

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Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.

Computational Modeling in Semiconductor Processing
Computational Modeling in Semiconductor Processing

Author: M. Meyyappan

Publisher: Artech House Publishers

Published: 1995

Total Pages: 384

ISBN-13:

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This book provides you with in-depth coverage of the models, governing equations, and numerical techniques suitable for process simulation -- so you can give your designs the competitive edge. You will understand the basic principles of transport phenomena, gas phase, and surface reactions in electronics material processing, and learn practical numerical techniques used in process simulations.