[PDF] Full Electronic Packaging Materials Science Vii Volume 323 Download eBook

Electronic Packaging Materials Science VII:

Author: Peter Børgesen

Publisher: Cambridge University Press

Published: 2014-06-05

Total Pages: 470

ISBN-13: 9781107409422

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Electronic Packaging Materials Science VII: Volume 323

Author: Peter Børgesen

Publisher:

Published: 1994-03-21

Total Pages: 480

ISBN-13:

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Electronic Packaging Materials Science

Author:

Publisher:

Published: 1996

Total Pages: 344

ISBN-13:

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Electronic Packaging Materials Science VIII: Volume 390

Author: Robert C. Sundahl

Publisher:

Published: 1995-09-26

Total Pages: 312

ISBN-13:

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The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.

Electronic Packaging Materials Science III: Volume 108

Author: Ralph Jaccodine

Publisher: Mrs Proceedings

Published: 1988

Total Pages: 514

ISBN-13:

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Electronic Packaging Materials Science IX: Volume 445

Author: Steven K. Groothuis

Publisher:

Published: 1997-10-20

Total Pages: 344

ISBN-13:

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While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.