Dopant Profile Changes Induced by Pulsed Laser Annealing
Dopant Profile Changes Induced by Pulsed Laser Annealing

Author:

Publisher:

Published: 1978

Total Pages:

ISBN-13:

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Secondary ion mass spectrometry (SIMS) and Rutherford ion backscattering was used to investigate the effects of pulsed laser annealing (Q switched ruby laser, 50 x 10−9 sec. pulse duration time) on silicon crystals implanted by B, P, As, Sb, Cu, and Fe. The results show that B, P, As, and Sb undergo substantial redistribution in the absence of significant surface segregation during the laser annealing process. Calculations strongly suggest that the crystal can be melted to a depth of approx. 1.mu. and the implanted region remains in the melted state for several hundred nanoseconds. Profiles calculated for liquid phase diffusion of the dopant are shown to be in excellent agreement with the experimental results. Arsenic profiles after laser annealing are shown to be very sensitive to the laser photon energy density. Profiles for implanted Cu and Fe show significant segregation to the surface after pulsed laser annealing and this may be related to their very low segregation coefficient from the liquid.

Laser-Assisted Microtechnology
Laser-Assisted Microtechnology

Author: Simeon M. Metev

Publisher: Springer Science & Business Media

Published: 2013-03-08

Total Pages: 283

ISBN-13: 3642973272

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Laser-Assisted Microtechnology deals with laser applications to a wide variety of problems in microelectronic design and fabrication. It covers micromachining of thin films, microprocessing of materials, maskless laser micropatterning and laser-assisted synthesis of thin-film systems. The monograph describes fundamental aspects and practical details of the technological processes as well as the optimum conditions for their realization.

Advances in Laser Materials Processing
Advances in Laser Materials Processing

Author: Jonathan R. Lawrence

Publisher: Woodhead Publishing

Published: 2017-09-20

Total Pages: 802

ISBN-13: 0081012535

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Advances in Laser Materials Processing: Technology, Research and Application, Second Edition, provides a revised, updated and expanded overview of the area, covering fundamental theory, technology and methods, traditional and emerging applications and potential future directions. The book begins with an overview of the technology and challenges to applying the technology in manufacturing. Parts Two thru Seven focus on essential techniques and process, including cutting, welding, annealing, hardening and peening, surface treatments, coating and materials deposition. The final part of the book considers the mathematical modeling and control of laser processes. Throughout, chapters review the scientific theory underpinning applications, offer full appraisals of the processes described and review potential future trends. A comprehensive practitioner guide and reference work explaining state-of-the-art laser processing technologies in manufacturing and other disciplines Explores challenges, potential, and future directions through the continuous development of new, application-specific lasers in materials processing Provides revised, expanded and updated coverage